Electronic components having high-frequency elements and methods of manufacture therefor

An integrated unitary body for use in an electronic device, comprising:

• a semiconductor substrate having opposite first and second surfaces;
• a monocrystalline quartz crystal piezoelectric plate having opposite first and second surfaces, said second surface of said piezoelectric plate being direct bonded to said first surface of said semiconductor substrate such that component atoms of said semiconductor substrate and component atoms of said piezoelectric plate are coupled mutually through at least one member selected from the group consisting of oxygen and hydroxyls.

An integrated unitary body for use in an electronic device, comprising:

• a semiconductor substrate having opposite first and second surfaces;
• a monocrystalline piezoelectric plate having opposite first and second surfaces and being formed of a material selected from the group consisting of monocrystalline lithium niobate, monocrystalline lithium tantalate, and monocrystalline lithium borate, said second surface of said piezoelectric plate being direct bonded to said first surface of said semiconductor substrate such that component atoms of said semiconductor substrate and component atoms of said piezoelectric plate are coupled mutually through at least one member selected from the group consisting of oxygen and hydroxyls.

An integrated unitary body for use in an electronic device, comprising:

• a semiconductor substrate having opposite first and second surfaces;
• a monocrystalline piezoelectric plate having opposite first and second surfaces and being formed of a material selected from the group consisting of monocrystalline lithium niobate, monocrystalline lithium tantalate, and monocrystalline lithium borate, said piezoelectric plate being bonded to said semiconductor substrate such that said second surface of said piezoelectric plate confronts said first surface of said semiconductor substrate;
• a thin film interposed between said semiconductor substrate and said piezoelectric plate, said thin film being direct bonded to one of said semiconductor substrate and said piezoelectric plate such that component atoms of said thin film are coupled, through at least one member selected from the group consisting of oxygen and hydroxyls, to component atoms of the one of said semiconductor substrate and said piezoelectric plate that is direct bonded to said thin film.

An integrated unitary body for use in an electronic device, comprising:

• a glass substrate having opposite first and second surfaces;
• a monocrystalline piezoelectric plate having opposite first and second surfaces and being formed of a material selected from the group consisting of monocrystalline lithium niobate, monocrystalline lithium tantalate, and monocrystalline lithium borate, said second surface of said piezoelectric plate being direct bonded to said first surface of said glass substrate such that component atoms of said glass substrate and component atoms of said piezoelectric plate are coupled mutually through at least one member selected from the group consisting of oxygen and hydroxyls.

An integrated unitary body for use in an electronic device, comprising:

• a glass substrate having opposite first and second surfaces;
• a monocrystalline piezoelectric plate having opposite first and second surfaces and being formed of a material selected from the group consisting of monocrystalline lithium niobate, monocrystalline lithium tantalate, and monocrystalline lithium borate, said piezoelectric plate being bonded to said glass substrate such that said second surface of said piezoelectric plate confronts said first surface of said glass substrate;
• a thin film, formed by one of a deposition process and a sputtering process, interposed between said glass substrate and said piezoelectric plate, said thin film being direct bonded to one of said glass substrate and said piezoelectric plate such that component atoms of said thin film are coupled, through at least one member selected from the group consisting of oxygen and hydroxyls, to component atoms of the one of said glass substrate and said piezoelectric plate that is direct bonded to said thin film.

An integrated unitary body for use in an electronic device, comprising:

• a substrate having opposite first and second surfaces and being formed of a material selected from the group consisting of lithium niobate, lithium tantalate, and lithium borate;
• a monocrystalline quartz crystal piezoelectric plate having opposite first and second surfaces, said second surface of said piezoelectric plate being direct bonded to said first surface of said substrate such that component atoms of said substrate and component atoms of said piezoelectric plate are coupled mutually through at least one member selected from the group consisting of oxygen and hydroxyls.

An integrated unitary body for use in an electronic device, comprising:

• a substrate having opposite first and second surfaces and being formed of a material selected from the group consisting of quartz, lithium niobate, lithium tantalate, and lithium borate;
• and
• a non-thin film monocrystalline piezoelectric plate having opposite first and second surfaces and being formed of a material selected from the group consisting of monocrystalline lithium niobate, monocrystalline lithium tantalate, and monocrystalline lithium borate, said second surface of said piezoelectric plate being direct bonded to said first surface of said substrate such that component atoms of said substrate and component atoms of said piezoelectric plate are coupled mutually through at least one member selected from the group consisting of oxygen and hydroxyls.