Surface mount socket for an electronic package, and contact for use therewith
OwnerAttalee S. Taylorinventor
Life of this patent
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Abstract
A socket for an electronic package comprises a dielectric housing having contacts each with a surface mount section extending below a bottom surface of the housing for engagement with a respective circuit trace on a circuit board. The surface mount section of each contact has a convex bottom surface with a shape which simulates at least a lower surface portion of a solder ball, whereby the socket imitates the footprint of a ball grid array package. A contact having a convex bottom surface which simulates a solder ball is also disclosed
Claims16
A socket for interconnecting an electronic package to a circuit board, comprising:
- a dielectric housing having a top surface for receiving the electronic package thereon, a bottom surface, and a plurality of cavities extending between the top and bottom surfaces;
- contacts disposed in respective ones of the cavities, each of the contacts comprising body electrically conductive body which is stamped and formed from a material strip, the body having a retention section securable in its said cavity, a lead-receiving section extending upwardly and engageable with a respective lead of the electronic package, and a surface mount section extending below the bottom surface and engageable with a respective circuit trace on the circuit board, the surface mount section having a convex bottom surface which is formed by stamping a portion of the material strip into a shape which mimics at least a lower surface portion of a sphere.
A contact for use in a socket for interconnecting an electronic package to a circuit board, the contact comprising:
- an electrically conductive body which is stamped and formed from a material strip, the body having a retention section securable in a cavity in the socket, a lead-receiving section engageable with a lead of the electronic package, and a surface mount section engageable with a circuit trace on the circuit board, the surface mount section having a convex bottom surface which is formed by stamping a portion of the material strip into a shape which mimics at least a lower surface portion of a sphere.
A contact for use in a socket for interconnecting an electronic package to a circuit board, the contact comprising:
- an electrically conductive body which is stamped and formed from a material strip, the body having a retention section securable in a cavity in the socket, a lead-receiving section engageable with a lead of the electronic package, and a surface mount section engageable with a circuit trace on the circuit board, the surface mount section having a convex bottom surface which is formed by stamping a portion of the material strip into a shape which simulates at least a bottom surface portion of a solder ball.
Dependencies are inferred from the claim text.