Voltage-controlled oscillator having a semiconductor integrated circuit, a piezoelectrics resonator and a diode and variable-capacitance diode
AssigneeSeiko Epson Corporation
InventorsManabu Oka, Yukari Nakajima, Masayuki Kikushima, Kazuhiko Shimodaira
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Abstract
A voltage-controlled oscillator is provided having a semiconductor integrated circuit and a piezoelectric resonator. A variable-capacitance diode may be connected in series with the piezoelectric resonator. The variable-capacitance diode may be further mounted a land of a lead frame. The piezoelectric resonator, variable-capacitance diode and lead frame may be resin molded into a single unit. In operation, a signal may be applied to a node located between the variable-capacitance diode and the DC-cutting capacitor.
Claims16
A voltage-controlled oscillator comprising:
- a semiconductor integrated circuit including at least an inverter;
- a piezoelectric resonator;
- and
- a variable-capacitance diode, wherein said piezoelectric resonator and said variable capacitance diode are connected in series between input and output terminals of said inverter, wherein a DC-cutting capacitor is disposed between said variable-capacitance diode and said inverter, a first node located between said piezoelectric resonator and said variable-capacitance diode is connected to ground by a bias resistor, and a signal is applied to a second node located between said variable-capacitance diode and said DC-cutting capacitor.
A voltage-controlled oscillator comprising:
- a semiconductor integrated circuit mounted on an island of a lead frame and being electrically connected to an inner lead of said lead frame by a wire-bonded wire;
- a piezoelectric resonator being disposed adjacent to said semiconductor integrated circuit;
- a lead of said piezoelectric resonator being electrically connected to said lead frame;
- and
- an electronic component mounted on a land of said lead frame and being electrically connected to said lead frame, wherein said piezoelectric resonator, said electronic component and said lead frame are resin molded into a single unit, an outer part of said inner lead being exposed to an outside, wherein a first connecting portion of said lead frame and said lead of said piezoelectric resonator is located on a same straight line as a second connecting portion of said lead frame and said electronic component.
Dependencies are inferred from the claim text.