Platen coating structure for chemical mechanical polishing and method
AssigneeMotorola, Inc.
InventorJames F. Vanell
Life of this patent
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Abstract
A structure for protecting chemical mechanical polishing (CMP) apparatus components from corrosion includes a refractory metal oxide coating layer (33) formed over surfaces of a platen (32). In a preferred embodiment, the refractory metal oxide coating layer (33) is a plasma-flame sprayed chromium-oxide layer. In an alternative embodiment, a sealer layer (42) is placed at least within pores (41) of refractory metal oxide coating layer (33) for additional protection. The refractory metal oxide coating layer (33) is also suitable for protecting other CMP apparatus components that are susceptible to corrosion.
Claims29
A substrate planarization apparatus comprising:
- a carrier structure for holding the substrate during planarization;
- a platen having a first major surface that provides support for the substrate during planarization;
- and
- a coating formed on the first major surface to protect the first major surface from corrosion, wherein the coating comprises a refractory metal oxide.
A method for removing material from a substrate comprising the steps of:
- providing a substrate;
- placing the substrate onto a CMP apparatus having a platen, wherein the platen includes a major surface and a oxide ceramic coating formed over the major surface;
- and
- removing material from the substrate with the CMP apparatus.
A method for removing material from a work piece comprising the steps of:
- providing a work piece comprising a first material;
- placing the work piece onto a polishing apparatus having a support member, wherein the support member includes a major surface for supporting the work piece during polishing, and wherein the support member includes a deposited refractory metal oxide layer formed over the major surface;
- and
- removing at least a portion of the first material from the work piece.
A CMP apparatus comprising:
- a metal component having a surface susceptible to corrosion when exposed to a polishing slurry;
- and
- a refractory metal oxide protective layer formed over the surface.
A process for polishing a substrate comprising the steps of:
- providing the substrate;
- placing the substrate onto a CMP apparatus including a component having a refractory metal oxide coating formed on a surface;
- and
- removing material from the substrate with the CMP apparatus.
Dependencies are inferred from the claim text.