Apparatus for testing interconnects for semiconductor dice

An apparatus for testing a semiconductor die comprising:

• a base for retaining the die, said base including external leads and an opening;
• an interconnect mounted to the base, said interconnect including a substrate and contact members for electrically contacting the die, said contact members electrically connected to conductors formed on the interconnect and placed in electrical communication with the external leads on the base;
• an electrical connector configured for placement through the opening for contacting the substrate to provide an electrical path;
• and
• a current detector in electrical communication with at least one external lead on the base and with the electrical connector, said current detector configured to detect a leakage current.

An apparatus for testing a semiconductor die comprising:

• a package configured to retain the die, said package comprising a base with external leads, said package further comprising a force applying mechanism attachable to the base;
• an interconnect mounted to the base, said interconnect comprising a substrate, a plurality of contact members on the substrate for electrically contacting contact locations on the die, and a plurality of conductors on the substrate in electrical communication with the contact member and external leads;
• an electrical connector on the base comprising a pad and a dedicated external lead, said connector configured to contact the substrate to provide a conductive path for detecting a leakage current through the contact member or conductor to the substrate as the force applying mechanism biases the die against the interconnect;
• and
• a current sensing circuit in electrical communication with the dedicated external lead and at least one other external lead.

An apparatus for testing a semiconductor die comprising:

• a package configured to retain the die, said package comprising a base with external leads and an opening formed therein, said package further comprising a force applying mechanism attachable to the base;
• an interconnect mounted to the base, said interconnect comprising a substrate, contact members on the substrate for electrically contacting contact locations on the die, and conductors on the substrate in electrical communication with the contact members and external leads;
• an electrical connector placed through the opening in the package to contact the substrate and provide a conductive path for detecting a leakage current through the contact members or conductors to the substrate as the force applying mechanism biases the die against the interconnect;
• and
• a current sensing circuit in electrical communication with the electrical connector and with at least one external lead.