Apparatus for depositing solder and adhesive materials onto a printed circuit board

A solder paste and adhesive dispenser with a printed circuit board holder and a wiper assembly, the wiper assembly having an actuator and a blade attached to the actuator to separately deposit solder paste pads and adhesive pads on the printed circuit board as the wiper assemble translates the blade, comprising:

• a first stencil adapted to be attached to the dispenser, stencil having a thickness T.sub.1 and a plurality of first openings arranged in a first pattern, and the first stencil being engageable with the blade to deposit solder paste pads on the printed circuit board with a height h.sub.1 approximate to the thickness T.sub.1 ;
• and
• a second stencil adapted to be attached to the dispenser, the second stencil having a thickness T.sub.2 greater than T.sub.1, a plurality of recesses arranged in the first pattern, and a plurality of second openings, the plurality of recesses further having shapes corresponding to the first openings and a depth D which is at least as great as the thickness T.sub.1, and the second stencil being engageable with the blade to deposit adhesive pads on the printed circuit board with a height h.sub.2 approximate to the thickness T.sub.2.