Engagement assembly for connecting a heat dissipation device to an integrated circuits

An engagement assembly for connecting a heat dissipation device to an integrated circuit mounted to a pin seat, the pin seat having at least one protrusion formed on each of two parallel sides thereof, the heat dissipation device including a plurality of spaced fins on an upper side thereof in which each of the two outermost opposite rows of fins includes a holed fin having a hole defined therein, the engaging assembly comprising:

• an engaging plate mounted to each said holed fin, each said engaging plate including at least one first slot defined in a lower portion thereof for releasably engaging with the associated protrusion on the pin seat and a second slot defined in a mediate portion thereof, each said engaging plate further including a lip formed at a top thereof;
• a press plate mounted outside each said engaging plate, each said press plate including an eccentric hole defined therein;
• and
• a positioning element extended through the eccentric hole of each said press plate, the second slot of the associated engaging plate, and the hole of the associated holed fin;
• wherein when the press plate is rotated through a pre-determined angle rotated about the positioning element to bear against the lip of the associated engaging plate, the engaging plate is moved upwardly such that the first slot of the engaging plate firmly engages with the associated protrusion.