US 5,739,588 AGranted

Semiconductor device

AssigneeCitizen Watch Co., Ltd.

InventorsYoshihiro Ishida, Yoshinobu Ohmori, Ienobu Ikeda, Kazuhiko Terashima, Takeshi Toyoda

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Abstract

In a semiconductor device comprising an IC chip (8) mounted on a circuit substrate (7) and sealed with a molding resin (11), corner resist films (6a, 6b, 6c, 6d) are formed at positions corresponding to a corner A of the IC chip (8) on the circuit substrate (7), and the corner A of the IC chip (8) is bonded to these corner resist films by using a die bond (9). A die pattern (3a) is exposed outside the corner resist films, and a power supply pattern (3b) is so formed to encompass their periphery. The power supply terminal, the die pattern (3a) and the power supply pattern (3b) are connected to the IC chip (8) of the corners of the IC chip is improved and peel is prevented. Furthermore, bonding of a large number of bonding wires for supplying power can be freely made.

Claims12

Dependent claims

A semiconductor device comprising:

a resin substrate,
an IC chip to be disposed on the resin substrate and having an outer bottom shape with corner portions and a plurality of electrodes,
a circuit substrate mounted on the resin substrate, said circuit substrate including a die pattern for securing the IC chip onto the resin substrate, said die pattern having an outer shape greater than the outer bottom shape of the IC chip, and a connecting electrode for connecting the electrodes of the IC chip,
an insulating film having an outer shape smaller than that of the die pattern, said insulating film being disposed on the die pattern at a portion at least corresponding to the corner portions of the IC chip, said IC chip being die bonded to the insulating film, and
bonding wires connected between the IC chip and a part of the die pattern exposed from the insulating film.

2 more elements

Dependencies are inferred from the claim text.