Method of photolithographically producing a copper pattern on a plate of an electrically insulating material
AssigneeU.S. Philips Corporation
InventorsElisabeth Van Der Sluis-Van Der Voort, Sigrid M.R. Gelderland
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Abstract
A method of forming copper patterns on a selection plate for a display, the selection plate having a plurality of holes. The method provides copper patterns that form selected tracks on the selection plate and that are disposed internally of selected holes, the copper patterns being sealed with a corrosion-resistant layer of nickel-phosphorous. The method includes steps of forming a copper layer on at least one surface of the selection plate, forming a layer of nickel-boron on the copper layer, using cataphoretic lithographic processing to form the desired patterns, and providing a nickel-phosphorous layer to seal the patterns.
Claims20
A method for producing a selection plate for a display, the selection plate comprising a glass electrically insulating substrate having at least a first surface provided with a pattern of tracks, the insulating substrate comprising at least one hole having an internal surface and having metallization, the tracks and the metallization comprising copper, the method comprising the consecutive steps of:
- a) providing a copper layer on the first surface of the substrate and at least on the internal surface of the hole;
- b) providing the copper layer with a nickel-boron layer;
- c) cataphoretically providing a photosensitive lacquer coating on the nickel-boron layer;
- d) exposing and developing the lacquer coating to remove a portion of the lacquer coating, so as to uncover a portion of the nickel-boron layer, the uncovered portion having associated therewith a portion of the copper layer;
- e) removing the uncovered portion of the nickel-boron layer, and removing the portion of the copper layer associated therewith, so as to form a pattern of tracks on the first surface of the substrate and to form the metallization of the hole, the pattern and the metallization comprising nickel-boron from the nickel-boron layer and copper from the copper layer;
- f) stripping the remaining lacquer coating;
- and
- g) providing a nickel-phosphorous layer to cover the nickel-boron of the pattern of tracks of the first surface of the substrate and the metallization of the hole.
A method for producing a selection plate for a display, the selection plate comprising a glass electrically insulating substrate having at least a first surface provided with a pattern of metallization, the metallization having a sidewall extending away from the first surface of the substrate, the metallization comprising copper, the method comprising the consecutive steps of:
- a) providing a copper layer on the surface of the substrate;
- b) providing the copper layer with a nickel-boron layer;
- c) cataphoretically providing a photosensitive lacquer coating on the nickel-boron layer;
- d) selectively exposing and developing the lacquer coating to remove a portion of the lacquer coating, so as to uncover a portion of the nickel-boron layer, the uncovered portion having associated therewith a portion of the copper layer;
- e) removing the uncovered portion of the nickel-boron layer, and removing the portion of the copper layer, so as to form a pattern of metallization on the substrate comprising nickel-boron from the nickel-boron layer and copper from the copper layer;
- f) stripping the remaining lacquer coating;
- g) providing a nickel-phosphorous layer in association with the nickel-boron of the pattern of metallization.
A method of manufacturing a control plate for a display, the control plate comprising a glass substrate having at least a first surface provided with a pattern of tracks, the substrate comprising a plurality of holes having internal surfaces and having metallization, the tracks and the metallization comprising copper, the method comprising the consecutive steps of:
- a) providing the glass substrate;
- b) subjecting the substrate to a powder blasting treatment with abrasive particles to form the holes in the substrate;
- c) providing a copper layer on the first surface of the substrate and at least on the internal surfaces of the holes;
- d) providing the copper layer with a nickel-boron layer;
- e) cataphoretically providing a photosensitive lacquer coating on the nickel-boron layer;
- f) exposing and developing the lacquer coating to remove a portion of the lacquer coating, so as to uncover a portion of the nickel-boron layer, the uncovered portion having associated therewith a portion of the copper layer;
- g) removing the uncovered portion of the nickel-boron layer, and removing the portion of the copper layer associated therewith, so as to form a pattern of tracks on the first surface of the substrate and to form the metallization of the hole, the pattern and the metallization comprising nickel-boron from the nickel-boron layer and copper from the copper layer;
- h) stripping the remaining lacquer coating;
- and
- I) providing a nickel-phosphorous layer on the nickel-boron of the pattern of tracks of the first surface of the substrate and the metallization of the holes.
A method of producing a control plate for a display, comprising an electrically insulating substrate having metallized through-holes and connected metal tracks, which method comprises the consecutive steps of:
- providing a glass plate as a substrate;
- forming through-holes in the substrate;
- depositing a copper layer on at least one surface of the substrate and the walls of the through-holes;
- depositing a nickel-boron layer on the copper layer;
- cataphoretically depositing a photosensitive lacquer coating on the nickel-boron layer;
- patternwise exposing the lacquer coating with actinic radiation in accordance with desired metal tracks, thereby forming cured and non-cured portions of the lacquer coating, cured portions being formed coinciding with the desired metal tracks and in the through-holes;
- developing the lacquer coating to remove the non-cured portions of the lacquer coating to reveal portions of the nickel-boron layer;
- etching to remove the revealed portions of the nickel-boron layer and portions of the copper layer underlying the revealed portions of the nickel-boron layer, thereby forming metal tracks;
- stripping to remove the cured portions of the lacquer coating from remaining portions of the nickel-boron layer on the metal tracks and on the walls of the through-holes;
- and then
- depositing an electroless nickel-phosphorous layer on the remaining portions of the nickel-boron layer.
Dependencies are inferred from the claim text.