Brazeless ceramic-to-metal bonding for use in implantable devices
AssigneeAdvanced Bionics AG
InventorRichard P. Malmgren
Life of this patent
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Abstract
In method of forming a hermetically sealed electrical feedthrough comprising, a feedthrough is positioned in a hole, the hole passing through a structure. The feedthrough includes a first material and the structure including a second material. A compressive force directed at the structure is applied to the feedthrough, and an equal force directed at the feedthrough is applied to the structure. The equal force is applied in a direction opposite the compressive force. The feedthrough and the structure are heated to a diffusion temperature whereat the first material and the second material undergo diffusion so as to cause a hermetically sealed bond between the first and second materials, and the hermetically sealed bond is thereby formed between the feedthrough and the structure.
Claims19
A method of forming a hermetically sealed electrical feedthrough comprising:
- positioning a feedthrough in a hole, the hole passing through a structure, the feedthrough including a first material and the structure including a second material;
- applying a compressive force to the feedthrough, the compressive force being directed at the structure;
- applying an equal force to the structure, the equal force being directed at the feedthrough and being in a direction opposite the compressive force;
- and
- heating the feedthrough and the structure to a diffusion temperature whereat the first material and the second material undergo diffusion so as to cause a hermetically sealed bond between the first and second materials;
- whereby the hermetically sealed bond is formed between the feedthrough and the structure.
A method of forming a hermetically sealed bond between a feedthrough and a structure, the method including:
- positioning the feedthrough in a hole, the hole passing through the structure;
- compressing isodynamically the feedthrough against the structure, so as to isodynamically press the feedthrough and the structure together at a bonding junction;
- and
- heating the feedthrough and the structure to a diffusion temperature, the feedthrough including a first material and the structure including a second material, the first material and the second material undergoing diffusion in response to the heating, and the diffusion causing a hermetically sealed bond between the first and second materials;
- whereby a hermetically sealed bond is formed between the feedthrough and the structure.
Dependencies are inferred from the claim text.