Chemical reducing solution for copper oxide
AssigneeHitachi Chemical Company, Ltd.
InventorsAkishi Nakaso, Youichi Kaneko
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Abstract
A chemical reducing solution obtained by using an alkali boron hydride as a reductant and adding thereto a water-soluble, polyoxyethylene chain-containing organic compound having a molecular weight of 200 or above molecule as an additive has merits in that it can reduce copper oxide to metallic copper while maintaining the needle-like form of copper oxide as completely as possible and the reduction can be completed in a short period of time by a simple procedure, so that the chemical reducing solution is successfully usable in a process for producing a multi-layer printed circuit board.
Claims5
A chemical reducing solution for chemically reducing copper oxide to metallic copper which consists essentially of an aqueous solution of an alkali boron hydride admixed with a water-soluble polyoxyethylene chain-containing organic compound having a molecular weight of 200 or above and an alkali hydroxide to provide a pH value of 11.0 or above.
Dependencies are inferred from the claim text.