Lapping process for minimizing shorts and element recession at magnetic head air bearing surface

In a process for batch fabricating magnetic transducers wherein said magnetic transducers are fabricated in rows on a wafer, each said magnetic transducer having a plurality of transducer elements exposed at an air bearing surface thereof, a method for lapping said air bearing surface to provide a desired height dimension for said transducer elements, comprising the steps of:

• separating said wafer into row bars, each said row bar including at least one row of a plurality of said magnetic transducers;
• moving said magnetic transducer in an oscillatory path generally parallel with a lapping surface, said oscillatory path being parallel to a longitudinal axis of said transducer elements exposed at said air bearing surface;
• maintaining said air bearing surface of said magnetic transducers in contact with said lapping surface for a first period during said oscillatory movement of said magnetic transducer, a pressure being applied during said first period such that a substantial amount of material is abraded from said air bearing surface;
• reducing said pressure during a second period such that an insubstantial amount of material is abraded from said air bearing surface during said second period as said magnetic transducer moves with respect to said lapping surface;
• during said second period, moving said lapping surface on a plane parallel with said air bearing surface, and not parallel to the direction of with said oscillatory path of said magnetic transducer;
• and
• reapplying said pressure during a third period such that a substantial amount of material is abraded from said air bearing surface during said third period to obtain the desired dimension of said transducer elements.