Underfill coating for LOC package
AssigneeMicron Technology, Inc.
InventorWalter L. Moden
Life of this patent
Estimating the term…
Abstract
An LOC die assembly is disclosed including a die dielectrically adhered to the underside of a lead frame. An underfill material is introduced between each lead finger and semiconductor die, extending from the bonding location of the die and the edge of the die, in order to prevent filler particles from lodging between the leads and the active surface of the die during transfer molding of a plastic encapsulant. The seal created by the underfill material reduces point stresses on the active surface of the die usually caused by the filler particles. The decreased flexure in the leads further enhances the locking of the leads in position with respect to the die.
Claims24
A method of assembling a semiconductor die to a lead frame to substantially eliminate the gap between the lead members of said lead frame and the active surface of said semiconductor die when said lead frame is assembled thereto, said method comprising the steps of:
- providing a lead frame having a plurality of lead members, at least one lead member of said plurality of lead members having longitudinal edges, having a top surface, having a bottom surface, having a lead end portion connected to a portion of the lead frame, having a length, having a thickness, and having a free end portion;
- providing a die having an active surface having at least one bond pad thereon and having at least one outer edge;
- providing an adhesively coated material;
- superimposing said lead frame on said die with said active surface lying adjacent said lead frame and said at least one lead member of the plurality of lead members extending over a portion of the active surface of said die;
- and
- securing a portion of the bottom surface of the free end portion said at least one lead member to one side of said adhesively coated material;
- securing a portion of said active surface of said die to the other side of the adhesively coated material;
- and
- applying an underfill material to the gap formed between the remaining unsecured portion of the bottom surface of the free end portion of said at least one lead member of said plurality of lead members and said active surface of said die to substantially eliminate said gap between said at least one lead member of said lead frame and said active surface of said semiconductor die when said lead frame is assembled thereto.
A method of transfer molding a plastic package about a die assembly using a molding compound including filler particles in a transfer molding machine, said method of transfer molding comprising the steps of:
- disposing a lead frame having an underfill material disposed between the bottom surface of a second portion of the length of at least one lead member of a plurality of lead members of said lead frame and a portion of an active surface of a die, said die being secured by its active surface to a first portion of said at least one lead member of said plurality of lead members in a lead-over-chip configuration in a mold cavity of said transfer molding machine;
- introducing a softened molding compound including filler particles therein into said mold cavity to form the plastic package;
- and
- reducing stress on the active surface of said die attributable to contact of the filler particles in the softened molding compound contacting the at least one lead member and the active surface of said die by said underfill material located between the bottom surface of said at least one lead member and the active surface of said die thereby preventing filler particles in the softened molding compound from flowing between said active surface of said die and the bottom surface of said at least one lead member of a plurality of lead members during said transfer molding.
Dependencies are inferred from the claim text.