Apparatus for the in-process detection of workpieces in a CMP environment

An apparatus for detecting the presence of workpieces on a polishing pad during a chemical mechanical polishing (CMP) procedure, said apparatus comprising:

• a probe assembly disposed proximate a polishing pad associated with a CMP system such that said probe assembly establishes intermittent optical communication with said polishing pad as at least one workpiece is processed on said polishing pad;
• a tungsten halogen light source configured to direct an input light signal at a surface of said polishing pad;
• a receptor configured to capture a portion of a scattered light response associated with said input signal;
• and
• a processor configured to process said portion of said scattered light response and to generate an output indicative of the presence of a dislodged, broken, or misaligned workpiece on said polishing pad.

An apparatus for detecting the presence of workpieces on a polishing pad during a chemical mechanical polishing (CMP) procedure, said apparatus comprising:

• a probe assembly disposed proximate a polishing pad associated with a CMP system such that said probe assembly establishes intermittent optical communication with said polishing pad as at least one workpiece is processed on said polishing pad;
• a light source configured to direct an input light signal at a surface of said polishing pad;
• a receptor configured to capture a portion of a scattered light response associated with said input signal;
• a processor configured to process said portion of said scattered light response and to generate an output indicative of the presence of a dislodged, broken, or misaligned workpiece on said polishing pad;
• and
• a CMP controller operatively connected to said processor, wherein said CMP controller causes said CMP system to stop processing in response to said output.