Ultrasonic vibration bonding machine

An ultrasonic vibration bonding machine for bonding together surfaces of a plurality of members at an overlapped interface, the ultrasonic bonding machine comprising:

• a mount having an uppermost portion adapted to receive the plurality of members such that the plurality of members are arranged with the surfaces to be bonded together in contact with each other to create the overlapped interface;
• a resonator having a first end, a second end and a bonding working portion disposed between the first and second ends;
• a transducer having an output end coupled to one of the first and second ends of the resonator, the transducer generating ultrasonic vibration having a resonant frequency with a corresponding wavelength, the resonator having a length equal to a multiple of 1/2 the wavelength of the resonant frequency, so that a maximum vibration amplitude point is formed at each of the first and second ends of the resonator and a minimum vibration amplitude point is formed on the resonator between the first and second ends;
• and
• a heater disposed to be in contact with one of the uppermost portion of the mount and the minimum vibration point of the resonator;
• wherein the bonding machine during operation is adapted to apply pressure to the overlapped interface through the bonding working portion of the resonator and the mount,
• wherein ultrasonic vibration is transmitted to the bonding working portion of the resonator from the transducer to bond the surfaces of the plurality of members.