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US 5,718,044 AGranted
Assembly of printing devices using thermo-compressive welding
AssigneeHewlett-Packard Company
InventorsKit Baughman, Paul H. McClelland
Life of this patent
Estimating the term…
Abstract
Components of the printing device are attached by a process employing thermo-compressive welding. The process results in a unitary, graded interface between the attached components and eliminates the need for applying thermal-cure adhesives to secure the components.
Claims16
A method of assembling components of a printing device, comprising the steps of:
- providing a first component;
- providing a second component;
- applying a first layer of conductive material to the first component;
- applying a second layer of conductive material to the second component;
- applying electric current through the first and second conductive layers by an amount sufficient to heat the layers, thereby melting portions of the first and second components that are adjacent to the first and second conductive layers;
- and
- pressing together the melted portions of the first and second components so that the melted portions of the components intermix and join upon cooling.
4 more elements
A method of assembling components of a printing device, comprising the steps of:
- providing a first component;
- providing a second component;
- bringing together the first and second components at an interface;
- applying heat, localized at the interface, by an amount sufficient so that portions of the first and the second components bond together at the interface, wherein the applying step includes the step of providing a layer of conductive material to at least one of the components and directing electric current through the conductive layer by an amount sufficient to heat the layers, thereby melting portions of the components that are adjacent to the conductive layer;
- and
- pressing together the melted portions of the first and second components so that the melted portions of the components intermix and bond upon cooling.
3 more elements
Dependencies are inferred from the claim text.