Printed-wiring board having plural parallel-connected interconnections

A printed-wiring board comprising:

• a first hard substrate having a plurality of first conductors formed thereon;
• a second hard substrate having a plurality of second conductors formed thereon, said second conductors being electrically connected to said first conductors, respectively;
• a flexible substrate for connecting said first and second hard substrates together;
• and
• a plurality of circuit patterns formed in each of said first and second hard substrates and said flexible substrate, for electrically connecting said first conductors with said second conductors through said flexible substrate, respectively,
• each of said circuit patterns comprising a plurality of parallel-connected conductive lines each being spatially separated from each other in said flexible substrate, and both ends of each of the parallel-connected conductive lines being located on the first and second hard substrates, respectively.

A printed-wiring board comprising:

• a plurality of hard substrates each having a conductor formed thereon;
• a flexible substrate for connecting said hard substrates together;
• and
• a circuit pattern formed in each of said hard substrates and said flexible substrate, for electrically connecting a conductor formed on a first hard substrate to a conductor formed on a second hard substrate through said flexible substrate,
• said circuit pattern comprising a plurality of parallel-connected conductive lines each being spatially separated from each other in said flexible substrate, and both ends of each of said parallel-connected conductive lines being located on said first and second hard substrates, respectively.

A printed-wiring board comprising:

• a plurality of hard substrates each having a plurality of conductors formed thereon;
• a flexible substrate for connecting said hard substrates together;
• and
• a plurality of circuit patterns formed in each of said hard substrates and said flexible substrate, each of said circuit patterns electrically connecting a conductor formed on a first hard substrate to a conductor formed on a second hard substrate through said flexible substrate, respectively,
• each of said circuit patterns comprising a plurality of parallel-connected conductive lines each being spatially separated from each other in said flexible substrate, and both ends of each of said parallel-connected conductive lines being located on said first and second hard substrates, respectively.