Method and apparatus for producing integrated circuit devices

A method for three dimensional lithography including the steps of:

• providing a substrate having surfaces extending in three dimensions and a light sensitive coating;
• and
• illuminating said substrate via a mask non-perpendicularly there-through with light impinging on at least two non-mutually parallel surfaces of said substrate.

A method for photolithographic forming of metal areas on an integrated circuit device including the steps of:

• providing an integrated circuit device substrate having surfaces extending in three dimensions and a light sensitive coating;
• and
• illuminating said substrate via a mask with light impinging on said surfaces at a non-perpendicular angle with respect to the mask.

A method for photolithographic forming of metal areas on an integrated circuit device including the steps of:

• providing an integrated circuit device substrate having surfaces extending in three dimensions and a light sensitive coating;
• and
• illuminating said integrated circuit device via a mask with light impinging on said surfaces at a non-perpendicular angle with respect to the mask.

Apparatus for three dimensional lithography including:

• an illuminator for illuminating a substrate having surfaces extending in three dimensions and a light sensitive coating via a mask with light impinging on said surfaces at a non-perpendicular angle with respect to the mask.

Apparatus for photolithographic forming of metal areas on an integrated circuit device including:

• an illuminator for illuminating an integrated circuit device substrate having surfaces extending in three dimensions and a light sensitive coating via a mask with light impinging on said surfaces at a non-perpendicular angle with respect to the mask.