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US 5,714,417 AGranted
Planarization process using artificial gravity
AssigneeVanguard International Semiconductor Corporation
InventorLinliu Kung
Life of this patent
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Abstract
The time needed to planarize the surface of an integrated circuit is reduced by causing the planarization liquid to settle in the presence of artificial gravity that supplements natural gravity. A number of different ways to achieve artificial gravity are described. These include centrifuging, magnetic repulsion, vertical pulling by a motor, and providing a pressure differential between the top and bottom sides of the wafer holder.
Claims10
A method for planarizing a surface of an integrated circuit wafer comprising:
- applying a quantity of a liquid, having a settling rate and a viscosity between about 10.sup.-2 and 10.sup.10 poise, to said surface
- increasing the settling rate by applying an artificial gravitational force to said liquid in a direction normal to said surface;
- and
- once the liquid has settled and has a planar upper surface, converting the liquid to a solid.
1 more element
Dependencies are inferred from the claim text.