US 5,714,265 AGranted

Composite body of silicone rubber and silicone-epoxy resin and method for the preparation thereof

AssigneeShin-Etsu Chemical Co., Ltd.

InventorsNoriyuki Meguriya, Takeo Yoshida, Yoshiteru Kobayashi

Life of this patent

Estimating the term…

Loading patent…

Abstract

Proposed is a method for the preparation of a monolithically integrated composite cured body consisting of a part of cured silicone rubber composition and a part of a silicone-epoxy resin composition firmly bonded together without using any primer or adhesive by first curing either one of the compositions in a metal mold and then bringing the other of the compositions into direct contact with the already cured part in the metal mold to be cured thereon. Firm bonding between the parts can be obtained when the silicone rubber composition is of the peroxide-curable or the hydrosilation-curable type and the silicone-epoxy resin composition comprises: (a) a curable epoxy resin; (b) an alkenyl group-containing organopolysiloxane; (c) an organohydrogenpolysiloxane; (d) an organosilicon compound having at least one silanol group in a molecule; (e) an organic aluminum compound such as aluminum benzoate; and (f) a compound of a platinum group metal such as chloroplatinic acid, each in a specified weight proportion.

Claims12

Dependent claims

A monolithically integrated cured composite body which is an integral body consisting of a part of a cured silicone rubber composition and a part of a cured silicone-epoxy resin composition in direct adhesive bonding without intervention of a third material therebetween, the silicone rubber composition being cured by means of an organic peroxide as a curing agent or cured by a hydrosilation reaction between silicon-bonded ethylenically unsaturated groups and silicon-bonded hydrogen atoms in the composition and the cured silicone-epoxy resin composition being cured from a uniform blend which comprises:

(a) 100 parts by weight of a curable epoxy resin;
(b) from 5 to 500 parts by weight of an organopolysiloxane having at least two on an average of lower alkenyl groups in a molecule;
(c) from 1 to 50% by weight, based on the component (b), of an organohydrogenpolysiloxane having at least one hydrogen atom bonded to a silicon atom in a molecule and represented by the general composition formula
R.sup.4.sub.f H.sub.g SiO.sub.(4-f-g)/2,
in which R.sup.4 denotes a monovalent hydrocarbon group optionally substituted by halogen, cyano, trimethylsilyl, trialkoxysilyl or epoxy groups, the subscript "f" denotes a positive number in the range from 1 to 2.4 and the subscript "g" denotes a positive number not exceeding 1;
(d) from 0.1 to 10 parts by weight of an organosilicon compound having at least one silanol group in a molecule;
(e) from 0.001 to 10 parts by weight of an organic aluminum compound;
and
(f) a compound of a platinum group metal in an amount in the range from 0.1 to 500 ppm by weight of the metal, based on the component (b).

6 more elements

(a) 100 parts by weight of a curable epoxy resin;
(c) from 1 to 50% by weight, based on the component (d') below of an organohydrogenpolysiloxane having at least one hydrogen atom bonded to a silicon atom in a molecule and represented by the general composition formula
R.sup.4.sub.f H.sub.g SiO.sub.(4-f-g)/2,
in which R.sup.4 denotes a monovalent hydrocarbon group optionally substituted by halogen, cyano, trimethylsilyl, trialkoxysilyl or epoxy groups, the subscript "f" denotes a positive number in the range from 1 to 2.4 and the subscript "g" denotes a positive number not exceeding 1;
(d') from 5 to 500 parts by weight of an organopolysiloxane compound having at least one silanol group and at least two lower alkenyl groups in a molecule and represented by the general composition formula
R.sup.6.sub.i (HO).sub.j SiO.sub.(4-i-j)/2,
in which R.sup.6 is a monovalent hydrocarbon group having 1 to 12 carbon atoms optionally substituted by halogen, trimethylsilyl, trialkoxysilyl or epoxy groups, of which from 2 to 80% by moles are lower alkenyl groups, the subscript "i" is a positive number in the range from 1 to 2.5 and the subscript "j" is a positive number not exceeding 2 with the proviso that "i+j" is in the range from 1 to 3;
(e) from 0.001 to 10 parts by weight of an organic aluminum compound;
and
(f) a compound of a platinum group metal in an amount in the range from 0.1 to 500 ppm by weight of the metal, based on the component (d').

7 more elements

A method for the preparation of a monolithically integrated cured composite body consisting of a first part of a cured silicone rubber composition and a second part of a cured silicone-epoxy resin composition, which method comprises:

(A) at least partly curing either one of a silicone rubber composition curable by organic peroxide or hydrosilation or a curable silicone-epoxy resin composition, which is a uniform blend comprising:
(a) 100 parts by weight of a curable epoxy resin;
(c) from 1 to 50% by weight, based on the component (d') below of an organohydrogenpolysiloxane having at least one hydrogen atom bonded to a silicon atom in a molecule and represented by the general composition formula
R.sup.4.sub.f H.sub.g SiO.sub.(4-f-g)/2,
in which R.sup.4 denotes a monovalent hydrocarbon group optionally substituted by halogen, cyano, trimethylsilyl, trialkoxysilyl or epoxy groups, the subscript "f" denotes a positive number in the range from 1 to 2.4 and the subscript "g" denotes a positive number not exceeding 1;
(d') from 5 to 500 parts by weight of an organopolysiloxane compound having at least one silanol group and at least two lower alkenyl groups in a molecule and represented by the general composition formula
R.sup.6.sub.i (HO).sub.j SiO.sub.(4-i-j)/2,
in which R.sup.6 is a monovalent hydrocarbon group having 1 to 12 carbon atoms optionally substituted by halogen, trimethylsilyl, trialkoxysilyl or epoxy groups, of which from 2 to 80% by moles are lower alkenyl groups, the subscript "i" is a positive number in the range from 1 to 2.5 and the subscript "j" is a positive number not exceeding 2 with the proviso that "i+j" is in the range from 1 to 3;
(e) from 0.001 to 10 parts by weight of an organic aluminum compound;
and
(f) a compound of a platinum group metal in an amount in the range from 0.1 to 500 ppm by weight of the metal, based on the component (d'),
at room temperature or by heating, in a metal mold to obtain a cured part;
(B) bringing the other of the curable silicone rubber composition or the curable silicone-epoxy resin composition into direct contact with the cured part from (A) in the metal mold;
and
(C) curing the composition introduced into the metal mold in (B), at room temperature or by heating, in the metal mold.

12 more elements

Dependencies are inferred from the claim text.

Facts

Application: 08/559,535Filed 16 Nov 1995
Priority: JP 6-28334217 Nov 1994
Granted: 3 Feb 1998
Term ends: Not estimatedThe source records don’t support an estimate.

Classification12 codes

B32B 25/20
Layered products comprising a layer of natural or synthetic rubber: comprising silicone rubber
B32B 7/10
Interconnection of layers: at least one layer having inter-reactive properties
B32B 25/08
Comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material: of synthetic…
B32B 27/26
Characterised by the use of special additives: using curing agents