# US 5,710,695 A · Leadframe ball grid array package

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- Number: US 5,710,695 A
- Document ID: US5710695A
- Status: Granted
- Kind: A
- Application number: 08/553,113
- Filed: 1995-11-07
- Granted: 1998-01-20
- Earliest claimed: 1995-11-07
- Assignees: VLSI Technology, Inc.
- Inventors: Kamran Manteghi
- Web page: https://patentgrep.com/patent/US5710695A

## CPC

- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 76/47: Solid or gel fillings
- H10W 72/07554: {changes in dispositions}
- H10W 72/547: {Dispositions of multiple bond wires}
- H10W 72/5522: {comprising gold [Au]}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A leadframe ball grid array package for packaging an integrated-circuit die includes a metallic substrate having a central portion and a leadflame having a plurality of inwardly-extending bonding fingers and a centrally-located open portion. The leadframe is directly attached to the metallic substrate by a non-conductive adhesive so that the open portion thereof overlies the central recessed portion of the metallic substrate. An integrated-circuit die is mounted in the central portion of the metallic substrate. The bonding fingers are disposed peripherally surrounding the integrated-circuit die. Bonding wires are interconnected between bonding pads formed on the integrated-circuit die and the plurality of bonding fingers. A solder mask is disposed over the top surface of the leadframe so as to form selective solderable areas. Solder balls are attached to the selective solderable areas. A plastic material or a lid is applied over the top surface of the die, bonding fingers and bonding wires.

## Claims

### Claim 1

A leadframe ball grid array package configuration for packaging an integrated-circuit die comprising:
a metallic substrate having a central recessed portion;
a leadframe having a plurality of inwardly-extending bonding fingers and a centrally-located open portion;
said leadframe being directly attached onto said metallic substrate by a non-conductive adhesive so that the open portion thereof overlies the central recessed portion of said metallic substrate;
an integrated-circuit die being mounted in the central recessed portion of said metallic substrate, said plurality of bonding fingers being disposed peripherally surrounding said integrated-circuit die;
bonding wires interconnected between bonding pads formed on said integrated-circuit die and said plurality of bonding fingers;
a solder mask being disposed over the top surface of said leadframe so as to form selective solderable areas; and
solder balls being attached to said selective solderable area.

### Claim 2 (depends on 1)

A leadframe ball grid array package configuration as claimed in claim 1, including a plastic material being applied over the top surface of said die, bonding fingers, and bonding wires.

### Claim 3 (depends on 1)

A leadframe ball grid array package configuration as claimed in claim 1, including a lid fixed over the top surface of said die, bonding fingers, and bonding wires.

### Claim 4 (depends on 3)

A leadframe ball grid array package configuration as claimed in claim 3, wherein said lid is metal.

### Claim 5 (depends on 3)

A leadframe ball grid array package configuration as claimed in claim 3, wherein said lid is ceramic.

### Claim 6 (depends on 1)

A leadframe ball grid array package configuration as claimed in claim 1, wherein said leadframe is stamped or chemically etched from a sheet of leadframe material.

### Claim 7 (depends on 6)

A leadframe ball grid array package configuration as claimed in claim 6, wherein said leadframe material is a metal.

### Claim 8 (depends on 7)

A leadframe ball grid array package configuration as claimed in claim 7, wherein said metal is selected from the group consisting of copper, iron, nickel, aluminum, and alloys thereof.

### Claim 9 (depends on 8)

A leadframe ball grid array package configuration as claimed in claim 8, wherein said bonding fingers are plated with a highly conductive material.

### Claim 10 (depends on 9)

A leadframe ball grid array package configuration as claimed in claim 9, wherein said highly conductive material is selected from the group consisting of silver and gold.

### Claim 11 (depends on 2)

A leadframe ball grid array package configuration as claimed in claim 2, wherein said plastic material is selected from the group consisting of a molding compound and an epoxy encapsulant.

### Claim 12 (depends on 1)

A leadframe ball grid array package configuration as claimed in claim 1, wherein said solder mask is applied by a process selected from the group consisting of a screen printing and a photo imaging process.

### Claim 13 (depends on 1)

A leadframe ball grid array package configuration as claimed in claim 1, wherein said metallic substrate is comprised of aluminum which is anodized so as to form an insulating layer.

### Claim 14 (depends on 1)

A leadframe ball grid array package configuration as claimed in claim 1, wherein said non-conductive adhesive is comprised of an epoxy material.