Card like semiconductor device

A semiconductor device comprising:

• a circuit board having a chip region on a main side there of, said circuit board also including an antenna region separate from said chip region;
• an IC chip mounted along said chip region of said circuit board, said IC chip having at least one bump contact extending therefrom for electrically connecting said IC chip to said circuit board along said main side;
• a protective resin layer substantially encapsulating said at least one bump;
• a first loop-like antenna pattern for transmitting and receiving a signal, said first loop-like antenna pattern being formed integrally along said antenna region of said circuit board and being spaced from said IC chip for driving said IC chip by induction;
• and
• a second loop-like antenna pattern formed on a rear side of said circuit board, said second loop-like antenna pattern being serially connected to said first loop-like antenna pattern.

A card like semiconductor device, comprising:

• a circuit board having a chip region on a main side thereof, said circuit board also having a rear side opposite said main side;
• an IC chip mounted along said chip region of said circuit board, said IC chip having at least one bump contact extending therefrom for electrically connecting said IC chip to said circuit board along said main side;
• a protective resin layer substantially encapsulating said at least one bump contact;
• a first loop-like antenna pattern spaced from said IC chip on said main side;
• and
• a second loop-like antenna pattern, formed integrally on a rear side of said circuit board, said second loop-like antenna pattern being serially connected via through holes to said first loop-like antenna pattern to form a single antenna pattern for transmitting and receiving a signal without contacting an external source of power and for inducing power electromagnetically.

A card like semiconductor device comprising:

• a circuit board having at least one two interconnected surfaces, wherein one of said at least two interconnected surfaces is a main surface;
• an IC chip mounted along said surface of said circuit board, said IC chip having at least one bump contact for electrically connecting said IC chip to said circuit board along said main surface;
• a protective resin layer substantially encapsulating said at least one bump contact;
• a first loop-like antenna pattern formed integrally on said main surface, said first loop-like antenna pattern being spaced from said IC chip;
• and
• a second loop-like antenna pattern formed on one of said at least two interconnected surfaces, said first and second antenna patterns driving said IC chip by inducing power electromagnetically,
• wherein said at least two interconnecting surfaces include a rear surface, the semiconductor device further comprising:
• a third loop-like antenna pattern formed on said rear surface of said circuit board and connected to said first loop-like antenna pattern via through holes;
• and
• a fourth loop-like antenna pattern formed on said rear surface of said circuit board and connected to said second loop-like antenna pattern.