# US 5,710,234 A · Ortho spiroesters and curable and cured resin compositions of same

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 5,710,234 A
- Document ID: US5710234A
- Status: Granted
- Kind: A
- Application number: 08/583,055
- Filed: 1996-01-19
- Granted: 1998-01-20
- Earliest claimed: 1993-07-20
- Assignees: Nippon Steel Chemical Co., Ltd.; Nippon Steel Corporation
- Inventors: Koichi Fujishiro; Masaya Furukawa; Kazuhiro Watanabe; Takero Teramoto
- Web page: https://patentgrep.com/patent/US5710234A

## CPC

- C07D 493/10: Spiro-condensed systems
- G03F 7/027: Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds (G03F7/075 takes precedence)
- G03F 7/0045: {with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors}
- C07D: HETEROCYCLIC COMPOUNDS (macromolecular compounds C08)
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)

## Abstract

Ortho spiroesters of excellent heat resistance and low volume shrinkage during curing are disclosed. Resin compositions of excellent heat resistance and low curing shrinkage containing these ortho spiroesters are also provided. These photosensitive or heat-curable resin compositions are formulated from photo- or heat-polymerizable compounds containing ethylenic double bonds and carboxyl groups, photopolymerization initiators and sensitizers, or polymerization initiators which generate radicals by heat, and said ortho spiroesters. These resin compositions have low curing shrinkage and are useful for applications requiring dimensional accuracy such as molding materials, encapsulants, adhesives and coatings and also for the preparation of image-forming materials such as protective films for color filters, inks and electrically insulating spacers for touch panels.

## Claims

### Claim 1

An ortho spiroester represented by the following general formula (1) ##STR13## wherein A is ##STR14## with R designating hydrogen or a lower alkyl group, m is 0 to 10 and q is an integer from 2 to 10.

### Claim 2 (depends on 1)

The ortho spiroester as claimed in claim 1, wherein R is hydrogen.

### Claim 3 (depends on 1)

The ortho spiroester as claimed in claim 1, wherein m is 0 to 3.

### Claim 4 (depends on 1)

The ortho spiroester as claimed in claim 1, wherein m is 1 to 10.

### Claim 5 (depends on 1)

The ortho spiroester as claimed in claim 1, wherein q is 2-5.

### Claim 6 (depends on 1)

The ortho spiroester as claimed in claim 1, wherein R is selected from the group consisting of hydrogen, methyl, ethyl, and isopropyl.
