# US 5,708,557 A · Puncture-resistant electrostatic chuck with flat surface and method of making the same

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- Number: US 5,708,557 A
- Document ID: US5708557A
- Status: Granted
- Kind: A
- Application number: 08/703,921
- Filed: 1996-08-22
- Granted: 1998-01-13
- Earliest claimed: 1996-08-22
- Assignees: Packard Hughes Interconnect Company
- Inventors: Haim Feigenbaum; Bao Le; Randy Lee Thomas; Dong Vo
- Web page: https://patentgrep.com/patent/US5708557A

## CPC

- H02N 13/00: Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
- H10P 72/72: using electrostatic chucks
- H10P 72/722: {Details of electrostatic chucks}
- Y10T 279/23: with magnetic or electrostatic means
- H02N: ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

The invention includes a puncture-resistant electrostatic chuck with a flat surface and a method of making the same. The electrostatic chuck includes a conductive layer such as copper foil that is laminated to a first insulation layer such as a polyimide. A puncture-resistant layer is placed over the conductive layer and includes random or woven fibers held together by a resin. The puncture-resistant layer has an uneven topography on a top surface due to the fibers contained therein. A second insulation layer overlies the puncture-resistant layer and has a top surface which is substantially flat. The flat top surface of the second insulation layer is made by laminating layers together with a mandrel which is polished and free of irregularities such as pits, dents and high spots. Preferably the mandrel has a uniform thickness over its entire surface.

## Claims

### Claim 1

An electrostatic chuck for plasma etching apparatus comprising a conductive layer, a puncture-resistant layer comprising a plurality of fibers impregnated within a resin wherein a top surface of the puncture-resistant layer has an irregular rough topography including high spots and depressions associated with the plurality of fibers, said conductive layer and puncture-resistant layer being encapsulated in an insulative layer, the insulative layer having an upper surface of which a substantial portion is flat, planar and substantially free of irregularities.

### Claim 2 (depends on 1)

An electrostatic chuck as set forth in claim 1 wherein a bottom surface of the insulative layer is secured to an electrode.

### Claim 3

A method of making an electrostatic chuck providing a conductive layer, placing a puncture-resistant layer at least over a portion of the conductive layer wherein the puncture-resistant layer comprises a plurality of fibers impregnated in the resin and wherein the puncture-resistant layer includes a top surface having a rough irregular topography including high portions and depressions associated with the plurality of fibers, placing an insulative layer over the puncture-resistant layer and forcing a mandrel having a polished surface free of irregularities against the insulative layer under sufficient temperature and pressure to produce a top surface in the insulative layer which is smooth and free of irregularities such as pits, dents and high spots.

### Claim 4 (depends on 3)

A method as set forth in claim 3 wherein said insulative layer comprises a polyimide material.

### Claim 5 (depends on 3)

A method as set forth in claim 3 wherein said conductive layer comprises a copper foil.

### Claim 6 (depends on 3)

A method as set forth in claim 3 wherein said fibers comprise a polycarbonate material.

### Claim 7 (depends on 3)

A method as set forth in claim 3 wherein said resin comprises a polyimide.

### Claim 8 (depends on 3)

A method as set forth in claim 3 wherein said fibers comprise about 10 to about 25 weight percent of said puncture-resistant layer.

### Claim 9 (depends on 3)

A method as set forth in claim 3 wherein said conductive layer comprises a copper foil having a thickness ranging from about 1/4 micron to about 0.0014 inches.