# US 5,708,299 A · Multichip press-contact type semiconductor device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,708,299 A - Document ID: US5708299A - Status: Granted - Kind: A - Application number: 08/656,868 - Filed: 1996-05-30 - Granted: 1998-01-13 - Earliest claimed: 1985-05-31 - Assignees: Kabushiki Kaisha Toshiba - Inventors: Satoshi Teramae; Michiaki Hiyoshi - Web page: https://patentgrep.com/patent/US5708299A ## CPC - H10W 72/00: Interconnections or connectors in packages - H10W 90/00: Package configurations - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract IGBT chips and FRD chips are arranged on the same plane so as to be press-contacted by an emitter press-contact electrode plate and a collector press-contact electrode plate at the same time. The FRD chips are arranged at a central portion, and the IGBT chips are arranged at the peripheral portion of the FRD chips. A resin substrate having an opening in its contact portion between a main surface of each of said chip and the emitter press-contact electrode plate is provided between both press-contact electrode plates. Gate press-contact electrodes are formed on the resin substrate to be electrically connected to a gate electrode of each of the IGBT chips. Also, gate wires are fixed to the resin substrate to supply a control signal for controlling the IGBT chips to the gate electrode of the IGBT chips from the gate wires through the gate press-contact electrode. ## Claims ### Claim 1 A press-contact type semiconductor device comprising: a plurality of semiconductor chips, each having a control electrode, solderlessly arranged on the same plane; first and second press-contact electrode plates for press-contacting said plurality of semiconductor chips at the same time; an insulation substrate, formed between said first and second press-contact electrode plates, having openings at a contact portion between a main surface of each of said semiconductor chips and said first press-contact electrode plate; press-contact electrodes provided on said insulation substrate to be electrically connected to the control electrode of each of said semiconductor chips; and control wires, fixed to said insulation substrate, for supplying a control signal for controlling said respective semiconductor chips to the control electrode of each of said semiconductor chip through said press-contact electrodes. ### Claim 2 (depends on 1) The press-contact type semiconductor device according to claim 1, further comprising a protection cover for protecting the control wires fixed to said insulation substrate. ### Claim 3 (depends on 1) The press-contact type semiconductor device according to claim 1, further comprising a disk type heat buffer plate provided between said plurality of semiconductor chips and said second press-contact electrode plate. ### Claim 4 (depends on 1) The press-contact type semiconductor device according to claim 1, further comprising a plurality of heat buffer plates each provided between the main surface of each of said plurality of semiconductor chip and said first press-contact electrode plate. ### Claim 5 (depends on 4) The press-contact type semiconductor device according to claim 4, further comprising a plurality of sliver sheets each provided between the main surface of each of said plurality of semiconductor chips and said plurality of heat buffer plates. ### Claim 6 (depends on 1) The press-contact type semiconductor device according to claim 1, wherein said plurality of semiconductor chips include FRD chips arranged at a central portion and IGBT chips arranged to surround said FRD chips, and said respective FRD chips are connected to said respective IGBT chips in parallel such that their current flowing directions are opposite to each other. ### Claim 7 (depends on 1) The press-contact type semiconductor device according to claim 1, further comprising chip frames, provided between the main surface of each of said semiconductor chips and said first press-contact electrode plate, for positioning and fixing each of said semiconductor chips in a horizontal direction. ### Claim 8 (depends on 7) The press-contact type semiconductor device according to claim 7, further comprising an insulation frame, provided in the main surface of each of said plurality of semiconductor chips, having openings at positions corresponding to said respective semiconductor chips, wherein said chip frames have notch portions in the outer peripheral portion, said insulation frame has projecting portions to be engaged with the notch portions of said chip frames, said chip frames and said insulation frame are engaged with each other, thereby positioning and fixing each of said semiconductor chips in upper and lower directions. ### Claim 9 (depends on 1) The press-contact type semiconductor device according to claim 1, wherein said first press-contact electrode plate has columnar projecting portions at the positions corresponding to said respective semiconductor chips, and the main surface of each of said semiconductor chips is press-contacted by said projecting portions. ### Claim 10 A press-contact type semiconductor device comprising: a first group of semiconductor chips solderlessly arranged on the same plane; a second group of semiconductor chips, each having a control electrode solderlessly, arranged around said first group of semiconductor chips to be on the same plane as said first group of semiconductor chips; first and second press-contact electrode plates for press-contacting said first and second groups of semiconductor chips at the same time; an insulation substrate, formed between said first and second press-contact electrode plates, having openings at a contact portion between a main surface of each of said semiconductor chips of said first and second groups of semiconductor chips and said first press-contact electrode plate; press-contact electrodes provided on said insulation substrate to be electrically connected to the control electrode of each of said second group of semiconductor chips; and control wires, fixed to said insulation substrate, for supplying a control signal for controlling said second group of semiconductor chips to the control electrode of said second group of semiconductor chips through said press-contact electrodes. ### Claim 11 (depends on 10) The press-contact type semiconductor device according to claim 10, further comprising a protection cover for protecting the control wires fixed to said insulation substrate. ### Claim 12 (depends on 11) The press-contact type semiconductor device according to claim 11, wherein said protection cover is engaged with said insulation substrate. ### Claim 13 (depends on 10) The press-contact type semiconductor device according to claim 10, further comprising a disk type heat buffer plate provided between said first and second groups of semiconductor chips and said second press-contact electrode plate. ### Claim 14 (depends on 13) The press-contact type semiconductor device according to claim 13, further comprising a plurality of sliver sheets each provided between the main surface of each of said first and second groups of semiconductor chips and said heat buffer plate. ### Claim 15 (depends on 10) The press-contact type semiconductor device according to claim 10, further comprising a plurality of heat buffer plates each provided between the main surface of each of said first and second groups of semiconductor chips and said first press-contact electrode plate. ### Claim 16 (depends on 15) The press-contact type semiconductor device according to claim 15, further comprising a plurality of sliver sheets each provided between the main surface of each of said first and second groups of semiconductor chips and said plurality of heat buffer plates. ### Claim 17 (depends on 15) The press-contact type semiconductor device according to claim 15, further comprising soft metallic foil having low resistance provided between said plurality of heat buffer plates and said first and second groups of semiconductor chips. ### Claim 18 (depends on 10) The press-contact type semiconductor device according to claim 10, wherein the semiconductor chips of said first group of semiconductor chips are FRD chips, and the semiconductor chips of said second group of semiconductor chips are IGBT chips, and said respective FRD chips are connected to said respective IGBT chips in parallel such that their current flowing directions are opposite to each other. ### Claim 19 (depends on 10) The press-contact type semiconductor device according to claim 10, further comprising chip frames, provided between the main surface of each of said first and second groups of semiconductor chips and said first press-contact electrode plate, for positioning and fixing said first and second groups of semiconductor chips in a horizontal direction. ### Claim 20 (depends on 19) The press-contact type semiconductor device according to claim 19, further comprising an insulation frame, provided in the main surface of each of said first and second groups of semiconductor chips, having openings at positions corresponding to said first and second groups of semiconductor chips, wherein said chip frames have notch portions in the outer peripheral portion, said insulation frame has projecting portions to be engaged with the notch portions of said chip frames, said chip frames and said insulation frame are engaged with each other, thereby positioning and fixing said first and second groups of semiconductor chips in upper and lower directions. ### Claim 21 (depends on 10) The press-contact type semiconductor device according to claim 10, wherein said first press-contact electrode plate has columnar projecting portions at the positions corresponding to said first and second groups of semiconductor chips, and said first and second groups of semiconductor chips is press-contacted by said projecting portions. ### Claim 22 A press-contact type semiconductor device comprising: a plurality of semiconductor chips, each having a control electrode solderlessly, arranged on the same plane; first and second press-contact electrode plates for press-contacting said plurality of semiconductor chips at the same time; an insulation substrate, formed between said first and second press-contact electrode plates, having openings at a contact portion between a main surface of each of said semiconductor chips and said first press-contact electrode plate; press-contact electrodes provided on said insulation substrate to be electrically connected to the control electrode of each of said semiconductor chips; control wires, fixed to said insulation substrate, for supplying a control signal for controlling said respective semiconductor chips to the control electrode of each of said semiconductor chip through said press-contact electrodes; and at least one of a resistor for preventing oscillation to be mounted on said insulation substrate, a thermistor for detecting temperature, a current detecting element for detecting an overcurrent, an overcurrent detecting circuit, and a protection circuit for protecting said respective semiconductor chips. ### Claim 23 (depends on 22) The press-contact type semiconductor device according to claim 22, further comprising a protection cover for protecting said control wires fixed to said insulation substrate and at least one of a resistor for preventing oscillation to be mounted on said insulation substrate, a thermistor for detecting temperature, a current detecting element for detecting an overcurrent, an overcurrent detecting circuit, and a protection circuit for protecting said respective semiconductor chips. ### Claim 24 (depends on 23) The press-contact type semiconductor device according to claim 23, wherein said protection cover is engaged with said insulation substrate. ### Claim 25 (depends on 22) The press-contact type semiconductor device according to claim 22, further comprising a disk type heat buffer plate provided between said plurality of semiconductor chips and said second press-contact electrode plate. ### Claim 26 (depends on 25) The press-contact type semiconductor device according to claim 25, further comprising a plurality of sliver sheets each provided between said plurality of semiconductor chips and said heat buffer plate. ### Claim 27 (depends on 22) The press-contact type semiconductor device according to claim 22, further comprising a plurality of heat buffer plates each provided between the main surface of each of said plurality of semiconductor chips and said first press-contact electrode plate. ### Claim 28 (depends on 27) The press-contact type semiconductor device according to claim 27, further comprising a plurality of sliver sheets each provided between the main surface of each of said plurality of semiconductor chips and said plurality of heat buffer plates. ### Claim 29 (depends on 27) The press-contact type semiconductor device according to claim 27, further comprising soft metallic foil having low resistance provided between said plurality of heat buffer plates and said plurality of semiconductor chips. ### Claim 30 (depends on 22) The press-contact type semiconductor device according to claim 22, wherein said plurality of semiconductor chips include FRD chips arranged at a central portion and IGBT chips arranged to surround said FRD chips, and said respective FRD chips are connected to said respective IGBT chips in parallel such that their current flowing directions are opposite to each other. ### Claim 31 (depends on 22) The press-contact type semiconductor device according to claim 22, further comprising chip frames, provided between the main surface of each of said semiconductor chips and said first press-contact electrode plate, for positioning and fixing each of said semiconductor chips in a horizontal direction. ### Claim 32 (depends on 22) The press-contact type semiconductor device according to claim 22, wherein said first press-contact electrode plate has columnar projecting portions at the positions corresponding to said respective semiconductor chips, and the main surface of each of said semiconductor chips is press-contacted by said projecting portions. ### Claim 33 A press-contact type semiconductor device comprising: a plurality of semiconductor chips solderlessly arranged on the same plane; an insulation frame, provided in the main surface of each of said plurality of semiconductor chips, and having openings at positions corresponding to said respective semiconductor chips; a disk type heat buffer plate provided on a rear surface of said semiconductor chips; and first and second press-contact electrode plates for press-contacting said plurality of semiconductor chips at the same time, wherein said insulation frame and said disk type heat buffer plate sandwich said respective semiconductor chips from upper and lower directions, thereby positioning and fixing said respective semiconductor chips. ### Claim 34 (depends on 33) The press-contact type semiconductor device according to claim 33, wherein said plurality of semiconductor chips include FRD chips arranged at a central portion and IGBT chips arranged to surround said FRD chips, and said respective FRD chips are connected to said respective IGBT chips in parallel such that their current flowing directions are opposite to each other. ### Claim 35 (depends on 33) The press-contact type semiconductor device according to claim 33, further comprising chip frames, provided between the main surface of each of said semiconductor chips and said first press-contact electrode plate, for positioning and fixing each of said semiconductor chips in a horizontal direction. ### Claim 36 (depends on 33) The press-contact type semiconductor device according to claim 33, wherein said first press-contact electrode plate has columnar projecting portions at the positions corresponding to said respective semiconductor chips, and the main surface of each of said semiconductor chips is press-contacted by said projecting portions. ### Claim 37 (depends on 33) The press-contact type semiconductor device according to claim 33, further comprising a ring frame, having an opening corresponding to said second press-contact electrode plate, and engaged with said insulation frame, thereby sandwiching said plurality of semiconductor chips and said disk type heat buffer plate.