# US 5,708,293 A · Lead frame and method of mounting semiconductor chip > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,708,293 A - Document ID: US5708293A - Status: Granted - Kind: A - Application number: 08/777,495 - Filed: 1996-12-30 - Granted: 1998-01-13 - Earliest claimed: 1996-01-05 - Assignees: Matsushita Electronics Corporation - Inventors: Takao Ochi; Hisashi Funakoshi; Ichiro Okumura; Hajime Honma; Keiji Okuma; Keiichi Fujimoto - Web page: https://patentgrep.com/patent/US5708293A ## CPC - H10W 70/427: {Bent parts} - H10W 70/411: {Chip-supporting parts, e.g. die pads} - H10W 70/415: {Leadframe inner leads serving as die pads} - H10W 72/5522: {comprising gold [Au]} - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract In a unit part of a lead frame for mounting a semiconductor chip, connecting leads and supporting leads extending from a lead frame main body toward a semiconductor chip mounting region are formed. Between each supporting lead and the lead frame main body, a movable part and a spring part for elastically supporting the movable part are disposed. The tip portion of the supporting lead connected with the movable part extends to the inside of the semiconductor chip mounting region in the natural state of the movable part, so that the tip portion butts against the side face of a semiconductor chip when the semiconductor chip is mounted. Thus, the semiconductor chip can be supported and fixed by using a bias force applied by the spring part. The base portions of the supporting leads, the movable part and the spring part do not remain in a package, and hence do not cause a stress in the package and do not increase the volume of the package. Thus, the invention provides a lead frame for forming a LOC package with high reliability which can contain a semiconductor chip having a large area within a regulated volume. ## Claims ### Claim 1 A lead frame for use in a resin sealed die-padless semiconductor package comprising: a lead frame main body surrounding a semiconductor chip mounting region for mounting a semiconductor chip; a plurality of connecting leads, each extending from said lead frame main body toward said semiconductor chip mounting region to be electrically connected with a part of said semiconductor chip; a plurality of supporting leads each having a base portion connected with said lead frame main body and positioned out of a sealed area to be sealed by a resin, and a tip portion for clipping said semiconductor chip by butting against a side face of said semiconductor chip when said semiconductor chip is mounted; a movable part disposed between at least one of said supporting leads and said lead frame main body relatively movably against said lead frame main body; and a spring part disposed between said movable part and said lead frame main body for elastically supporting said movable part and, when said movable part is shifted from a natural state thereof, for applying to said movable part a bias force in a direction reverse to movement of said movable part, wherein said tip portion of said supporting lead connected with said movable part is positioned within said semiconductor chip mounting region in the natural state, is movable to be positioned out of said semiconductor chip mounting region in accordance with the movement of said movable part, and is adoptable to support said semiconductor chip by using the bias force of said spring part by butting against the side face of said semiconductor chip when said semiconductor chip is mounted. ### Claim 2 (depends on 1) The lead frame of claim 1, wherein said movable part is provided with an engaging portion to be engaged with a member for moving said movable part. ### Claim 3 (depends on 2) The lead frame of claim 2, wherein, when said member for moving said movable part is a pin, said engaging portion is an opening to be engaged with said pin. ### Claim 4 (depends on 1) The lead frame of claim 1, wherein said supporting leads are disposed at two opposing portions of said lead frame for clipping two opposing side faces of said semiconductor chip, and said movable part is disposed between said lead frame main body and said base portions of said supporting leads disposed at each of said two opposing portions. ### Claim 5 (depends on 4) The lead frame of claim 4, wherein a plurality of said supporting leads are disposed at each of said opposing portions. ### Claim 6 (depends on 1) The lead frame of claim 1, wherein said supporting leads are disposed at two opposing portions of said lead frame for clipping two opposing side faces of said semiconductor chip, and said movable part is disposed between said lead frame main body and said base portions of said supporting leads disposed at one of said two opposing portions, with no movable part disposed between said lead frame main body and said base portions of said supporting leads disposed at the other of said two opposing portions, and said tip portions of said supporting leads disposed at the other of said two opposing portions accord with one end of said semiconductor chip mounting region. ### Claim 7 (depends on 6) The lead frame of claim 6, wherein a plurality of said supporting leads are disposed at each of said two opposing portions. ### Claim 8 (depends on 1) The lead frame of claim 1, wherein said tip portion of each of said supporting leads is bent to lie along the side face of said semiconductor chip. ### Claim 9 (depends on 1) The lead frame of claim 1, wherein said supporting leads are disposed in an upstream area and a downstream area of a flow of said resin in a resin sealing process for sandwiching said semiconductor chip mounting region, and said spring part has a structure for applying the bias force in a direction substantially parallel to a direction of the flow of said resin. ### Claim 10 (depends on 1) The lead frame of claim 1, wherein said spring part includes a plurality of linear spring leads extending in a parallel direction to each other. ### Claim 11 (depends on 10) The lead frame of claim 10, wherein said spring leads extend in a direction perpendicular to a direction of the bias force of said spring part. ### Claim 12 (depends on 10) The lead frame of claim 10, wherein said spring leads are disposed between said movable part and said lead frame main body, on both sides of a center line of said semiconductor chip mounting region extending in the same direction as said supporting leads, symmetrically to each other about the center line. ### Claim 13 (depends on 10) The lead frame of claim 10, wherein said spring leads are disposed at one portion of said movable part closer to said supporting lead and another portion closer to said lead frame main body, symmetrically to each other about a line perpendicular to a center line of said semiconductor chip mounting region extending in the same direction as said supporting leads. ### Claim 14 (depends on 1) The lead frame of claim 1, wherein said spring part is formed by a slit pattern formed in said lead frame. ### Claim 15 A method of mounting a semiconductor chip comprising the steps of: preparing a semiconductor chip; preparing a lead frame including a plurality of connecting leads extending from a lead frame main body toward a semiconductor chip mounting region, a plurality of supporting leads each having a base portion connected with said lead frame main body and a tip portion extending toward said semiconductor chip mounting region, a movable part disposed between at least one of said supporting leads and said lead frame main body relatively movably against said lead frame main body, and a spring part disposed between said movable part and said lead frame main body for elastically supporting said movable part, and when said movable part is shifted from a natural state thereof, for applying to said movable part a bias force in a direction reverse to movement of said movable part; positioning said tip portion of said supporting lead connected with said movable part out of said semiconductor chip mounting region by moving said movable part of said lead frame in a direction away from said semiconductor chip mounting region; with said tip portion of said supporting lead connected with said movable part positioned out of said semiconductor chip mounting region, setting said semiconductor chip in said semiconductor chip mounting region to be disposed below said connecting leads, and aligning said semiconductor chip and said lead frame main body for setting a vertical distance between said connecting leads and a main face of said semiconductor chip within a predetermined range; supporting said semiconductor chip by using the bias force of said spring part applied to said tip portion of said supporting lead by moving said supporting lead connected with said movable part in accordance with the bias force of said spring part until said tip portion of said supporting lead butts against a side face of said semiconductor chip; with said semiconductor chip supported by said supporting lead, electrically connecting said connecting leads with a part of said semiconductor chip and conducting resin sealing; and cutting off a part of each of said supporting leads extending from a predetermined position between said tip portion and said base portion toward said lead frame main body, a part of each of said connecting leads closer to said lead frame main body, said movable part, said spring part and said lead frame main body to be separated from a sealed part. ### Claim 16 (depends on 15) The method of mounting a semiconductor chip of claim 15, wherein said movable part is provided with an opening in the step of preparing said lead frame, in the step of positioning said tip portion of said supporting lead by moving said movable part, a pin is inserted through said opening and said pin is moved in the direction away from said semiconductor chip mounting region by supplying said inserted pin with a reaction force against the bias force of said spring part, and in the step of aligning said semiconductor chip and said lead frame main body, the reaction force against the bias force of said spring part is released from said pin, and said pin is pulled out of said opening after said tip portion of said supporting lead butts against the side face of said semiconductor chip.