# US 5,707,890 A · Method of shifting a wavelength in a semiconductor structure having quantum wells > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,707,890 A - Document ID: US5707890A - Status: Granted - Kind: A - Application number: 08/409,581 - Filed: 1995-03-24 - Granted: 1998-01-13 - Earliest claimed: 1994-04-06 - Assignees: Alcatel - Inventors: Jean-Yves Emery; Leon Goldstein - Web page: https://patentgrep.com/patent/US5707890A ## CPC - H01S 5/0265: {Intensity modulators (intra-cavity modulators H01S5/0625)} - B82Y 20/00: Nanooptics, e.g. quantum optics or photonic crystals - H01S 5/2059: {by means of particular conductivity zones, e.g. obtained by particle bombardment or diffusion} - H01S 5/3413: {comprising partially disordered wells or barriers} - H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL - B82Y: SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES ## Abstract From a top face of a semiconductor structure of the III-V type, inter-diffusion of elements between the wells and the barriers of an internal quantum structure is hot induced. The inter-diffusion is performed in one segment of the structure only, namely a segment in which the characteristic wavelength is to be shifted so as to constitute an amplitude modulator, another segment of the structure including a Bragg grating so as to constitute a laser emitter. In accordance with the invention, the inter-diffusion is induced by a layer of indium maintained in contact with the top face by means of a dielectric encapsulation layer. The invention is applicable in particular to optical telecommunications. ## Claims ### Claim 1 A method of shifting a wavelength in a semiconductor structure having quantum wells, in which method elements are inter-diffused between at least one well and a barrier of a quantum structure, which structure is inside a III-V type semiconductor structure, the inter-diffusion being hot induced by an inducing material acting from a face of the semiconductor structure, wherein induced inter-diffusion operating conditions are selected to prevent doping materials contained in a confinement layer of said semiconductor structure from being diffused into the quantum structure, and wherein the inducing material is in the form of a layer of condensed substance maintained in contact with said face of the semiconductor structure. ### Claim 2 (depends on 1) A method according to claim 1, wherein said inducing material is chosen from III and V elements respectively included in columns III and V of the periodic table of elements. ### Claim 3 (depends on 2) A method according to claim 2, wherein said inducing material is indium. ### Claim 4 (depends on 3) A method according to claim 3, wherein said layer of inducing material has a thickness lying in the range 3 nm to 300 nm. ### Claim 5 (depends on 1) A method according to claim 1, wherein said inter-diffusion is performed at an inter-diffusion temperature that is high enough to enable V elements to be diffused, and that is low enough to prevent III elements from being diffused. ### Claim 6 (depends on 5) A method according to claim 5, wherein said inter-diffusion temperature lies in the range 600.degree. C. to 700.degree. C. ### Claim 7 (depends on 1) A method according to claim 1, in which method firstly an initial mono-crystal structure is made of III-V type semiconductor materials including indium and gallium as III elements and phosphorus and arsenic as V elements, the ratio of the phosphorus content to the arsenic content of such a material constituting a phosphorus-to-arsenic ratio of the material, the structure having a longitudinal direction, a transverse direction, and a vertical direction, and including layers that succeed one another in the vertical direction in the following order between a bottom face and a top face of the structure: a bottom confinement layer of a first conductivity type; a quantum structure constituted by a vertical alternating succession of quantum wells and of barriers having border surfaces between the wells and the barriers, the phosphorus-to-arsenic ratio of the material of the wells being different from the phosphorus-to-arsenic ratio of the material of the barriers, the quantum structure having a characteristic wavelength that is dependent on said ratios, the wavelength being initially constant in the longitudinal direction; and a top confinement layer of a second conductivity type that is opposite to the first conductivity type so that a bias current being passed in a forward direction between the two confinement layers causes charge carriers of the two opposite types to be injected into the quantum structure, and so that the injection enables light waves having said characteristic wavelength of the quantum structure to be selectively amplified, the method then including the following steps: two separate segments are defined along the length of the initial structure, which segments constitute a shifted-wavelength segment and a conserved-wavelength segment; a protection layer is formed covering the top face of the initial structure in the conserved-wavelength segment while leaving that face exposed in the shifted-wavelength segment; in a shifting step, the top face is exposed under the action of a diffusion-inducing material at an inter-diffusion temperature, the concentration of the material and the temperature being sufficient to cause a modification affecting a surface portion of the top confinement layer, and to induce inter-diffusion of the V elements in the quantum structure via the top confinement layer, the inter-diffusion causing the phosphorus and the arsenic to diffuse via the border surfaces of the quantum structure, thereby causing a desired localized shift in the characteristic wavelength of the layer, the modification, the inter-diffusion, and the shift being at least limited by the protective layer in the conserved-wavelength segment; and the top face of the modified initial structure is etched so as to remove the protective layer in the conserved-wavelength segment, and the modified surface portion of the top confinement layer in the shifted-wavelength segment, whereby a structure is obtained which has a locally-shifted wavelength, which is capable of conducting said bias currents through said conserved-wavelength segment and through said shifted-wavelength segment, and which has different characteristic wavelengths in the two segments; wherein said shifting step includes the following steps: a layer of said inducing material is deposited on the top face of the initial structure; a leak-proof encapsulation layer that withstands the inter-diffusion temperature is deposited on said layer of inducing material; and the initial structure is heated to the inter-diffusion temperature. ### Claim 8 (depends on 7) The method according to claim 7, wherein said protective layer and said encapsulation layer are made of dielectric materials. ### Claim 9 (depends on 7) A method according to claim 7, wherein electrodes are deposited on the bottom face and on the top face of the structure having the locally-shifted wavelength, a resonant cavity being formed in that structure so as to make a semiconductor optical component including an emitter and a modulator in integrated form, the emitter being a laser emitter having positive gain in the conserved-wavelength segment, the modulator modulating the light from the emitter in the shifted-wavelength segment. ### Claim 10 (depends on 9) A method according to claim 9, wherein said resonant cavity is formed in the conserved-wavelength segment, said modulator modulating the amplitude of the light from the emitter. ### Claim 11 (depends on 3) The method according to claim 3, wherein said layer of inducing material has a thickness lying in the range 10 nm to 50 nm. ### Claim 12 (depends on 7) The method according to claim 7, wherein said protective layer is made of one of silica SiO.sub.2 and silicon nitride Si.sub.3 N.sub.4. ### Claim 13 (depends on 7) The method according to claim 7, wherein said encapsulation layer is made of one of silica SiO.sub.2 and silicon nitride Si.sub.3 N.sub.4. ### Claim 14 (depends on 1) The method according to claim 1, wherein the induced inter-diffusion operating conditions include heating temperature and duration.