# US 5,707,782 A · Photoimageable, dielectric, crosslinkable copolyesters

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- Number: US 5,707,782 A
- Document ID: US5707782A
- Status: Granted
- Kind: A
- Application number: 08/609,465
- Filed: 1996-03-01
- Granted: 1998-01-13
- Earliest claimed: 1996-03-01
- Assignees: The Board of Trustees of the University of Illinois
- Inventors: James Economy; Lizabeth A. Schneggenburger; Fang Shi
- Web page: https://patentgrep.com/patent/US5707782A

## CPC

- H10W 20/48: Insulating materials thereof
- G03F 7/027: Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds (G03F7/075 takes precedence)
- H10W 70/69: Insulating materials thereof
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)

## Abstract

Photosensitive, dielectric insulating, crosslinkable copolyester films used as dielectric and as photoresist films for microelectronics circuits which are also suitable for use in producing MCM-L packages. In various embodiments of the invention there is provided photosensitive, dielectric insulating, crosslinkable copolyester film forming mixtures for coating onto microelectronics substrate surfaces, a photosensitive oligomer for producing the crosslinkable copolyesters and MCM-L products produced using the crosslinked copolyesters.

## Claims

### Claim 1

A mixture for forming a film of a photosensitive, dielectric insulating, crosslinkale copolyeser, said mixture comprising:
(a) at least one oligomer having functional carboxylic acid end groups capped with methacryl groups, and
(b) at least one oligomer having functional acyloxy end groups, in a film-forming solvent for said oligomers, and wherein one of the oligomers has more than two of said functional end groups present in the oligomer for functioning to form said copolyester.

### Claim 2

A mixture for forming a film of a photosensitive, dielectric insulating, crosslinkable copolyester, said mixture comprising:
(a) at least one oligomer having functional ##STR10## end groups, and (b) at least one oligomer having functional C.sub.3 CO.sub.2 -- end groups, and one of the oligomers has more than two of said functional end groups present in the oligomer for functioning to form said copolyester.

### Claim 3 (depends on 2)

A mixture according to claim 2 wherein the monomers from which the oligomers have been made are selected from the group consisting of 4-hydroxybenzoic acid, 2-hydroxy-6-napthoic acid, hydroquinone, isophthalic acid, terephthalic acid, 4,4'-biphenol, trimesic acid, trimellitic acid, adipic acid, ethylene glycol, hydroquinone diacetate, 4-acetoxy-benzoic acid, 2-acetoxy-6-naphthoic acid, 4,4'-diacetoxybiphenol and 2-hydroxyethyl methacrylate.

### Claim 4 (depends on 3)

A mixture according to claim 3 wherein the monomers from which the oligomer has been made are selected from the group consisting of trimesic acid, hydroquinone diacetate and 4-acetoxybenzoic acid, isophthalic acid and 2-hydroxy-ethyl methacrylate.

### Claim 5 (depends on 4)

A mixture according to claim 4 wherein the oligomers have a molecular weight in the range of from about 700 to about 850.

### Claim 6 (depends on 1)

A mixture according to claim 1 wherein the oligomer having the acyloxy end groups comprises a partially to completely acetylated phenol-formaldehyde resin.