# US 5,707,749 A · Method for producing thin film multilayer wiring board

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 5,707,749 A
- Document ID: US5707749A
- Status: Granted
- Kind: A
- Application number: 08/494,974
- Filed: 1995-06-26
- Granted: 1998-01-13
- Earliest claimed: 1990-11-30
- Assignees: Hitachi, Ltd.
- Inventors: Junichi Katagiri; Akio Takahashi; Akira Nagai; Haruo Akahoshi; Kouji Fujisaki; Akio Mukoh; Fumiyuki Kobayashi
- Web page: https://patentgrep.com/patent/US5707749A

## CPC

- B32B 15/08: of synthetic resin
- B32B 27/281: {comprising polyimides}
- H05K 3/4655: {by using a laminate characterized by the insulating layer (general-purpose insulating materials H05K1/03, H05K3/4673)}
- B32B 2307/206: Insulating
- B32B 2307/306: Resistant to heat
- B32B 2307/3065: Flame resistant or retardant, fire resistant or retardant
- H05K 3/0017: {Etching of the substrate by chemical or physical means}
- H05K 3/386: {by the use of an organic polymeric bonding layer, e.g. adhesive}
- H05K 3/4652: {Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern (H05K3/4647 takes precedence)}
- H05K 2201/0154: Polyimide
- H05K 2201/0195: Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
- H05K 2203/107: Using laser light
- Y10T 29/49165: by forming conductive walled aperture in base
- Y10T 428/2848: Three or more layers
- Y10T 428/31721: Of polyimide
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A thin film multilayer wiring material excellent in reliability, yield, productivity, and higher positioning accuracy includes an insulation organic film having a wiring pattern on one surface and an adhesive layer on another principal surface. The insulation organic film is a polyimide film having a heat resistance at a pyrolysis beginning temperature of 350.degree. to 550.degree. C., a dielectric constant of 3.5-2.2 and a flame retardance of V-0 or V-1 according to the UL-94 standard. The adhesive layer contains an ether bismaleimide compound.

## Claims

### Claim 1

A thin film multilayer wiring material which comprises an insulation organic film having a wiring pattern layer on one principal surface and an adhesive layer on another principal surface; said insulation organic film being a polyimide film having a repeating structure represented by the following formula: ##STR7## wherein X represents an aromatic diamine residue and the adhesive layer contains an ether bismaleimide compound represented by the following formula: ##STR8## wherein R.sub.1 represents a hydrogen atom, a lower alkyl group or a lower fluoroalkyl group, R.sub.2 represents a hydrogen atom, a lower alkyl group or a lower fluoroalkyl group, m represents an integer of 1 to 4, and R.sub.3 and R.sub.4 each represents CH.sub.3 or CF.sub.3 and may be identical with or different from each other.

### Claim 2 (depends on 1)

A thin film multilayer wiring materiel according to claim 1, wherein the insulation organic film comprises a polymer having a heat resistance at a pyrolysis beginning temperature of 350.degree.to 550.degree. C., a dielectric constant of 3.5- 2.2, and a flame retardance of V-0 or V-1 according to the UL-94 standard.

### Claim 3 (depends on 1)

A thin film multilayer wiring material according to claim 1, wherein the insulation organic film has a thickness of 1 to 100 .mu.m.

### Claim 4 (depends on 1)

A thin film multilayer wiring material according to claim 1, wherein line thickness and line width of the wiring pattern formed on one surface of the insulation organic film are both 10 to 40 .mu.m.