# US 5,707,730 A · Adhesive for semiconductor device and reinforcing material using the same

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 5,707,730 A
- Document ID: US5707730A
- Status: Granted
- Kind: A
- Application number: 08/593,891
- Filed: 1996-01-30
- Granted: 1998-01-13
- Earliest claimed: 1993-12-20
- Assignees: Tomoegawa Paper Co., Ltd.
- Inventors: Tadahiro Oishi; Akira Tezuka
- Web page: https://patentgrep.com/patent/US5707730A

## CPC

- H10W 72/701: {Tape-automated bond [TAB] connectors}
- H10W 70/453: {comprising flexible metallic tapes}
- H10W 74/131: {the semiconductor body being only partially enclosed}
- H10W 74/47: comprising organic materials, e.g. plastics or resins
- H10W 72/077: {Connecting of TAB connectors}
- H10W 74/00: Encapsulations, e.g. protective coatings
- Y10T 428/2804: Next to metal
- Y10T 428/2826: Synthetic resin or polymer
- Y10T 428/2848: Three or more layers
- Y10T 428/287: including epoxy group or epoxy polymer
- Y10T 428/2896: including nitrogen containing condensation polymer [e.g., polyurethane, polyisocyanate, etc.]
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

An adhesive for bonding a reinforcing sheet to a lead-formed surface of a tape carrier package used for forming a semiconductor device, the adhesive being a resin composition which constitutes an interlayer between the lead-formed surface and the reinforcing sheet, comprises a polyamide resin having an amine value of 3.0 to 50 and an epoxy resin, is free from peeling and foaming, undergoes sufficient softening and curing at a temperature lower than about 150.degree. C., has high insulation reliability after cured, and has heat resistance against a temperature up to 260.degree. C.

## Claims

### Claim 1

A reinforcing material for a tape carrier package used for forming a semiconductor device,
the reinforcing material being a reinforcing sheet formed of a metal foil to be laminated on a lead-formed surface of the tape carrier package,
the reinforcing sheet formed of a metal foil having an adhesive layer to bond the said sheet to the lead-formed surface,
the adhesive layer being composed of a composition containing 100 parts by weight of a polyamide resin, 9 to 88 parts by weight of an epoxy resin and 5 to 60 parts by weight a phenolic resin, the polyamide resin having an amine value of 3.0 to 50.

### Claim 2 (depends on 1)

A reinforcing material according to claim 1, wherein the polyamide resin is an aliphatic polyamide or an aromatic polyamide.

### Claim 3 (depends on 1)

A reinforcing material according to claim 1, wherein the polyamide resin has a weight average molecular weight of 2,000 to 150,000 and a softening temperature of 50.degree. to 180.degree. C.

### Claim 4 (depends on 1)

A reinforcing material according to claim 1, wherein the resin composition further contains an imidazole compound.

### Claim 5 (depends on 4)

A reinforcing material according to claim 4, wherein the imidazole compound is incorporated in an amount of 0.03 to 10 parts by weight per 100 parts by weight of the epoxy resin.

### Claim 6 (depends on 1)

A reinforcing material according to claim 1, wherein the adhesive composition further contains an elastomer.

### Claim 7 (depends on 1)

A reinforcing material according to claim 1, wherein the adhesive composition further contains an inorganic filler or an organic filler in an amount of 5 to 95 parts by weight per 100 parts by weight of the adhesive composition.