# US 5,707,683 A · Electronic coating composition method of coating an electronic substrate, composition and article > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,707,683 A - Document ID: US5707683A - Status: Granted - Kind: A - Application number: 08/605,576 - Filed: 1996-02-22 - Granted: 1998-01-13 - Earliest claimed: 1996-02-22 - Assignees: Dow Corning Corporation - Inventors: Alexander Brian Currie; Cathryn Marie Haines; Michael Dean Little; Keith Winton Michael; Kristen Andrea Scheibert - Web page: https://patentgrep.com/patent/US5707683A ## CPC - H10P 14/6686: {the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane} - C04B 35/62222: {obtaining ceramic coatings (coating of mortars, concrete, artificial or natural stone or ceramics C04B41/45; laminated ceramic products B32B18/00; coating of glass C03C17/00, applying ceramic coatings on silicon for semi-conductor purposes H10W; coating metallic materials C23)} - C04B 41/009: {characterised by the material treated} - C04B 41/5035: {Silica} - H10P 14/6529: {by exposure to a gas or vapour} - H10P 14/6905: {being a silicon carbide or silicon carbonitride and not containing oxygen, e.g. SiC or SiC:H} - H10P 14/69215: {the material being a silicon oxide, e.g. SiO2} - H10P 14/6922: {the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC} - H10P 14/6925: {the material comprising hydrogen silsesquioxane, e.g. HSQ} - H10P 14/6927: {the material being a silicon oxynitride, e.g. SiON or SiON:H} - H10P 14/69433: {the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz} - H10P 95/06: {Planarisation of inorganic insulating materials} - H10W 74/476: {Organic materials comprising silicon} - C04B 2111/00844: {for electronic applications} - H10P 14/6342: {Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - C04B: LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE {(roofing granules E04D7/005)}; CERAMICS (devitrified glass-ceramics C03C10/00); REFRACTORIES; TREATMENT OF NATURAL STONE - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Disclosed are coating compositions which include a preceramic silicon-containing material dissolved in short chain linear siloxanes. The compositions have a long shelf life and are useful for forming coatings which are thick and of good quality. ## Claims ### Claim 1 A coating composition comprising: about 1 and about 50 weight percent preceramic silicon-containing material and about 50 to about 99 weight percent of a mixture of hexamethyldisiloxane and octamethyltrisiloxane in a ratio of 10:90 to 90:10. ### Claim 2 (depends on 1) The coating composition of claim 1 wherein the preceramic silicon-containing material is selected from the group consisting of hydrogen silsesquioxane resin, hydrolyzed or partially hydrolyzed R.sub.n Si(OR).sub.4-n, or combinations thereof, wherein each R is independently an aliphatic, alicyclic or aromatic substituent of 1-20 carbon atoms and n is 0-3. ### Claim 3 (depends on 2) The coating composition of claim 2 also containing modifying ceramic oxide precursors comprising a compound containing an element selected from the group consisting of titanium, zirconium, aluminum, tantalum, vanadium, niobium, boron and phosphorous wherein the compound contains at least one hydrolyzable substituent selected from the group consisting of alkoxy or acyloxy and the compound is present in an amount such that a silica coating formed from the coating composition contains 0.1 to 30 percent by weight modifying ceramic oxide. ### Claim 4 (depends on 1) The composition as claimed in claim 1 wherein the hexamethyldisiloxane and octamethyltrisiloxane are in a ratio of 10:90 to 40:60. ### Claim 5 A coating composition comprising: about 1 and about 50 weight percent hydrogen silsesquioxane resin and about 50 to about 99 weight percent of a mixture of hexamethyldisiloxane and octamethyltrisiloxane in a ratio of 10:90 to 90:10. ### Claim 6 (depends on 5) The coating composition of claim 5 also containing a platinum, rhodium or copper catalyst in an amount of between about 5 and about 1000 ppm platinum, rhodium or copper based on the weight of hydrogen silsesquioxane resin. ### Claim 7 (depends on 5) The coating composition of claim 5 wherein the composition comprises hydrogen silsesquioxane resin in an amount between about 5 and about 30 weight percent. ### Claim 8 A method of coating an electronic substrate comprising: applying a coating composition comprising about 1 and about 50 weight percent preceramic silicon-containing material and about 50 to about 99 weight percent of a mixture of hexamethyldisiloxane and octamethyltrisiloxane in a ratio of 10:90 to 90:10 onto an electronic substrate. ### Claim 9 (depends on 8) A method of coating an electronic substrate as claimed in claim 8 wherein the coated electronic substrate is thereafter heated to a temperature in the range of about 50.degree. to 800.degree. C. to convert the coating composition into a ceramic coating. ### Claim 10 (depends on 9) The coated electronic substrate produced by the method of claim 9. ### Claim 11 (depends on 8) A method of coating an electronic substrate as claimed in claim 8 wherein the coated substrate is thereafter heated in an inert atmosphere to a temperature above the melting point of the preceramic silicon-containing material to cause the coating to flow. ### Claim 12 (depends on 11) The coated electronic substrate produced by the method of claim 11. ### Claim 13 (depends on 8) The coated electronic substrate produced by the method of claim 8. ### Claim 14 A method of coating an electronic substrate comprising: applying a coating composition comprising about 1 and about 50 weight percent hydrogen silsesquioxane resin and about 50 to about 99 weight percent of a mixture of hexamethyldisiloxane and octamethyltrisiloxane in a ratio of 10:90 to 90:10 onto an electronic substrate. ### Claim 15 (depends on 14) A method of coating an electronic substrate as claimed in claim 14 wherein the coated substrate is thereafter heated in an inert atmosphere to a temperature above the melting point of the preceramic silicon-containing material to cause the coating to flow. ### Claim 16 (depends on 15) The coated electronic substrate produced by the method of claim 15. ### Claim 17 (depends on 14) A method of coating an electronic substrate as claimed in claim 14 wherein the coated electronic substrate is thereafter heated to a temperature in the range of about 50.degree. to 800.degree. C. to convert the coating composition into a ceramic coating. ### Claim 18 (depends on 17) The coated electronic substrate produced by the method of claim 17. ### Claim 19 (depends on 14) The coated electronic substrate produced by the method of claim 14. ### Claim 20 A coating composition comprising about 1 to about 50 weight percent preceramic silicon-containing material and about 50 to about 99 weight percent octamethyltrisiloxane. ### Claim 21 (depends on 20) The coating composition as claimed in claim 20 wherein the preceramic silicon-containing material is hydrogen silsesquioxane resin. ### Claim 22 A coating composition comprising about 1 and about 50 weight percent preceramic silicon-containing material and about 50 to about 99 weight percent decamethyltetrasiloxane. ### Claim 23 (depends on 22) The coating composition as claimed in claim 22 wherein the coating composition is hydrogen silsesquioxane resin. ### Claim 24 A method of coating an electronic substrate comprising: applying a coating composition comprising about 1 to about 50 weight percent preceramic silicon-containing material and about 50 to about 99 weight percent of a linear siloxane selected from the group consisting of octamethyltrisiloxane and decamethyltetrasiloxane onto an electronic substrate; and heating the coated electronic substrate to a temperature in the range of about 50.degree. C. to about 800.degree. C. to convert the coating composition into a ceramic coating. ### Claim 25 (depends on 24) The coated electronic substrate produced by the method of claim 24.