# US 5,707,558 A · Radiation sensitive resin composition

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- Number: US 5,707,558 A
- Document ID: US5707558A
- Status: Granted
- Kind: A
- Application number: 08/538,049
- Filed: 1995-10-02
- Granted: 1998-01-13
- Earliest claimed: 1995-10-02
- Assignees: Japan Synthetic Rubber Co., Ltd.; Arakawa Chemical Industries, Ltd.
- Inventors: Katsumi Inomata; Nasahiro Akiyama; Toshiyuki Ota; Akira Tsuji
- Web page: https://patentgrep.com/patent/US5707558A

## CPC

- G03F 7/022: Quinonediazides (G03F7/075 takes precedence)
- Y10S 428/901: Printed circuit
- Y10S 428/913: Material designed to be responsive to temperature, light, moisture
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)
- Y10S: TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

## Abstract

A radiation sensitive resin composition containing an alkali soluble resin and a 1,2-quinonediazide compound of a polyphenol or a radiation sensitive resin composition containing an alkali soluble resin and a 1,2-quinonediazide compound and a polyphenol compound.

## Claims

### Claim 1

A radiation sensitive resin composition comprising an alkali soluble resin, a 1,2-quinonediazide compound and a phenol compound represented by the following formula (1B): ##STR13## wherein X.sub.21 to X.sub.40 and Y.sub.5 to Y.sub.8 are the same or different from one another and are selected from the group consisting of a hydrogen atom, an alkyl moiety, an alkoxyl moiety and a hydroxyl moiety, provided that at least one of X.sub.21 to X.sub.25, at least one of X.sub.26 to X.sub.30, at least one of X.sub.31 to X.sub.35, at least one of X.sub.36 to X.sub.40 and at least one of Y.sub.5 to Y.sub.8 are a hydroxyl moiety.

### Claim 2 (depends on 1)

The radiation sensitive resin composition of claim 1, wherein the alkali soluble resin is selected from the group consisting of novolak resins, polyvinyl phenols, styrene-maleic anhydride copolymers, polyvinylhydroxy benzoates and carboxyl group-containing methacrylic acid resins.

### Claim 3 (depends on 1)

The radiation sensitive resin composition of claim 1, wherein the phenol compound represented by the above formula (1B) is contained in an amount of 5 to 50 parts by weight based on 100 parts by weight of the alkali soluble resin.

### Claim 4 (depends on 1)

The radiation sensitive resin composition of claim 1, wherein the 1,2-quinonediazide compound is selected from the group consisting of 1,2-benzoquinonediazide-4-sulfonates, 1,2-naphthoquinonediazide-4-sulfonates, 1,2-naphthoquinonediazide-5-sulfonates and 1,2-naphthoquinonediazide-6-sulfonates.

### Claim 5 (depends on 1)

The radiation sensitive resin composition of claim 1, wherein the 1,2-quinonediazide compound is contained in an amount of 100 parts or less by weight based on 100 parts by weight of the alkali soluble resin.

### Claim 6 (depends on 1)

The radiation sensitive resin composition of claim 1, wherein the alkyl moiety has 1-4 carbon atoms, and the alkoxyl moiety has 1-4 carbon atoms.

### Claim 7 (depends on 1)

The radiation sensitive resin composition of claim 1, further comprising at least one member selected from the group consisting of a sensitizer, a surfactant, a dye and a pigment.