# US 5,707,274 A · Chemical mechanical polishing apparatus for semiconductor wafer

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- Number: US 5,707,274 A
- Document ID: US5707274A
- Status: Granted
- Kind: A
- Application number: 08/756,559
- Filed: 1996-11-26
- Granted: 1998-01-13
- Earliest claimed: 1996-07-09
- Assignees: LG Semicon Co., Ltd.
- Inventors: Yong-Kwon Kim; Young-Kwon Jun
- Web page: https://patentgrep.com/patent/US5707274A

## CPC

- H10P 90/129: {by polishing}
- B24B 37/04: designed for working plane surfaces
- B24B 41/04: Headstocks; Working-spindles; Features relating thereto
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS

## Abstract

A chemical mechanical polishing apparatus for a semiconductor wafer which is capable of polishing uniformly the surface of the semiconductor wafer and of controlling the polishing amount by providing plurality of rotary drums each wrapped in a polishing cloth on the upper surface of a polishing pad and connecting supporters capable of vertical movement to both ends each rotary drum, and includes a rotatable polishing pad in the planar upper surface of which a plurality of recesses are formed for receiving a semiconductor wafer, a plurality of rotatable polishing units located on the polishing pad for planarizing the surface of the semiconductor wafers, a supporter connected at the endpoints of the rotational polishing units which can make a vertical movement, and a slurry applicator located above the rotational polishing units for putting a slurry thereon.

## Claims

### Claim 1

A chemical mechanical polishing (CMP) apparatus for a semiconductor wafer, comprising:
a rotatable polishing pad in a planar upper surface of which a plurality of recesses are formed for each receiving therein a semiconductor wafer;
a plurality of rotatable polishing means disposed on the polishing pad for planarizing the surfaces of the semiconductor wafer;
a vertically movable supporter means connected at endpoints of each polishing means; and
a slurry applicator located above each polishing means for applying a slurry thereto.

### Claim 2 (depends on 1)

The CMP apparatus of claim 1, wherein the polishing means includes:
a rotary drum wrapped with a polishing cloth;
a rotating axis connected to a central portion of the rotary drum; and
a driving motor connected to the one end of the rotary axis.

### Claim 3 (depends on 2)

The CMP apparatus of claim 2, wherein the rotary drum is shaped to be conical.

### Claim 4 (depends on 1)

The CMP apparatus of claim 1, wherein each slurry applicator supplies a different kind of slurry.

### Claim 5 (depends on 4)

The CMP apparatus of claim 4, wherein the slurry applicator has a slurry applicator exit which is longer than a diameter of a semiconductor wafer.

### Claim 6 (depends on 1)

The CMP apparatus of claim 1, wherein the upper surface of the polishing pad is formed to have a graded surface rising towards a central portion thereof.