# US 5,707,247 A · Low-profile zero-insertion force socket > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,707,247 A - Document ID: US5707247A - Status: Granted - Kind: A - Application number: 08/542,425 - Filed: 1995-10-12 - Granted: 1998-01-13 - Earliest claimed: 1995-10-12 - Assignees: Intel Corporation - Inventors: Rolf A. Konstad - Web page: https://patentgrep.com/patent/US5707247A ## CPC - H05K 7/1007: {with means for increasing contact pressure at the end of engagement of coupling parts} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A low-profile zero-insertion socket includes a plurality of resilient contacts mounted directly into the motherboard. The socket has a support plate slidingly attached to the motherboard and including a plurality of through apertures formed to receive the pins of a microprocessor package. A low-profile eccentric cam actuator, rotationally coupled to the motherboard, is provided for moving the support plate that bears the microprocessor to and from a position where the microprocessor pins engage the resilient contacts. ## Claims ### Claim 1 A socket for coupling to an integrated circuit package having a plurality of terminals, said socket comprising: a printed circuit board (PCB); contacts disposed in a plurality of openings of said PCB for providing electrical terminal connection in said PCB; a support plate movably attached to said PCB and disposed over said contacts to support said integrated circuit package, said support plate having a plurality of apertures, wherein said plurality of terminals extend through said apertures and into said openings; and actuation means mechanically coupled to said support plate and said PCB for moving said support plate so that said terminals engage with said contacts, thereby electrically coupling said integrated circuit package to said PCB. ### Claim 2 (depends on 1) The socket of claim 1 wherein said actuation means comprises a rotatable cam having an unlatched and a latched position, wherein rotation of said cam from said unlatched to said latched position causes a translational movement of said support plate relative to said PCB. ### Claim 3 (depends on 2) The socket of claim 2 wherein said contacts comprise a plurality of resilient contacts. ### Claim 4 (depends on 2) The socket of claim 2 wherein said support plate comprises a non-conductive plate. ### Claim 5 (depends on 2) The socket of claim 2 wherein said actuation means comprises a vertical eccentric cam rotationally coupled to said PCB and engaging said support plate, said cam having a detent that holds said cam in said unlatched and said latched positions. ### Claim 6 (depends on 2) The socket of claim 2 wherein said actuation means comprises a horizontal cam rotationally coupled to said PCB and engaging said support plate, said cam having a detent that holds said cam in said unlatched and said latched positions. ### Claim 7 A socket for attaching to a semiconductor device having a plurality of terminals, said socket comprising: a printed circuit board (PCB); a plurality of resilient contacts disposed in a plurality of openings of said PCB that provide electrical connection to said PCB; a support plate having a plurality of apertures corresponding to said plurality of terminals, said support plate slidingly attached to said PCB, said terminals extending through said apertures and into said openings such that when said support plate is moved from a first to a second position, said terminals engage said resilient contacts to electrically couple said semiconductor device to said PCB; and an actuator movably engaging said support plate. ### Claim 8 (depends on 7) The socket of claim 7 wherein said actuator comprises a cam rotationally coupled to said PCB and said support plate, said cam having an unlatched position and a latched position corresponding to said first and second positions, respectively. ### Claim 9 (depends on 8) The (zero-insertion-force) socket of claim 8 wherein said cam comprises a vertical eccentric cam)having a slotted head. ### Claim 10 (depends on 9) The (zero-insertion-force) socket of claim 9 wherein said vertical eccentric cam further includes a detent formed to engage said support plate in said first and second positions. ### Claim 11 (depends on 8) The (zero-insertion-force) socket of claim 8 wherein said cam comprises a horizontal cam. ### Claim 12 (depends on 7) The (zero-insertion-force) socket of claim 7 wherein each of said plurality of resilient contacts comprises a first cylindrical body portion having a vertical slot, and a contact head portion having an entrance opening and a pair of curvilinear contact elements. ### Claim 13 (depends on 12) The (zero-insertion-force) socket of claim 12 wherein each of said plurality of resilient contacts further comprises a second cylindrical body portion, said contact head portion being vertically oriented between said first cylindrical body portion and said second cylindrical body portion, and wherein said first cylindrical body portion includes a leading taper for insertion into said PCB. ### Claim 14 A tow-profile socket for coupling to a microprocessor having a plurality of terminals, said low-profile socket comprising: a motherboard having a plurality of openings; a plurality of resilient contacts disposed in said openings of said motherboard; a non-conductive support plate movably attached to said motherboard, said non-conductive support plate including a plurality of through apertures formed to receive said plurality of terminals such that said terminals extend through said apertures into said openings, said non-conductive support plate having an unlatched and a latched position, said resilient contacts being electrically disengaged from said plurality of terminals in said unlatched position, and said resilient contacts being electrically engaged with said plurality of terminals in said latched position; and an actuator for moving said non-conductive support plate into said latched position. ### Claim 15 (depends on 14) The low-profile socket of claim 14 wherein said actuator comprises a vertical eccentric cam including a slotted head, a cylindrical body portion concentric with said slotted head, and a cylindrical tail portion eccentric to said cylindrical body portion, said cylindrical body portion engaging a drive slot formed in said support plate, said cylindrical tail portion rotationally coupled to said motherboard via a cylindrical opening in said motherboard. ### Claim 16 (depends on 15) The low-profile socket of claim 15 wherein said drive slot is formed to allow lateral movement of said vertical eccentric cam without laterally loading said supporting plate. ### Claim 17 (depends on 15) The low-profile socket of claim 15 wherein said vertical eccentric cam further includes a flat detent formed on said cylindrical body portion, said flat detent alternatively engaging said support plate in said unlatched and said latched positions. ### Claim 18 (depends on 14) The low-profile socket of claim 14 wherein said actuator comprises a horizontal cam attached to said motherboard. ### Claim 19 A method of electrically connecting an integrated circuit package having a plurality of pins to a printed circuit board (PCB) comprising the steps of: (a) inserting a plurality of contact members into a corresponding plurality of openings in said PCB, an inner surface of said openings having a soldered connection to an electrical trace on said PCB, each of said contact members abutting in said soldered connection and also having at least one curvilinear member that accepts one of said pins; (b) mounting a support plate to said PCB such that said support plate slidingly moves over said opening upon rotation of a cam, said support plate having a plurality of through apertures that accept said pins; (c) placing said package onto said support plate such that said pins extend through said apertures into said openings while said support plate is in a first position; (d) rotating said cam from said first position to a second position thereby causing said pins to electrically engage said at least one curvilinear member of said contact members. ### Claim 20 (depends on 19) The method of claim 19 further comprising the step, performed after step (a), of: reflow soldering each of said contact members to said soldered connection. ### Claim 21 (depends on 19) The method of claim 19 wherein said cam comprises a vertical eccentric cam including a slotted head, a cylindrical body portion disposed in said support plate concentric with said slotted head, and a cylindrical tail portion disposed in said PCB eccentric to said cylindrical body portion, said cylindrical body portion having a detent that engages said vertical eccentric cam in said first and second positions, and wherein step (d) comprises the step of: placing a flat-headed tool into said slotted head; rotating said tool by 180 degrees such that said detent is disengaged from said first position, and engaged in said second position. ### Claim 22 A socket for attaching to a semiconductor device having a plurality of terminals, said socket comprising: a printed circuit board (PCB); a plurality of resilient contacts disposed in a plurality of openings of said PCB that provide electrical connection to said PCB, each of said plurality of resilient contacts comprising a first cylindrical body portion having a vertical slot, a second cylindrical body portion and a contact head portion vertically oriented between said first and second cylindrical body portions, said contact head having an entrance opening and a pair of curvilinear contact elements, said first cylindrical body portion includes a leading taper for insertion into said PCB; and a support plate having a plurality of apertures corresponding to said plurality of terminals slidingly attached to said PCB, said terminals extending through said apertures and into said openings such that when said support plate is moved by an actuator from a first to a second position, said terminals engage said resilient contacts to electrically couple said semiconductor device to said PCB. ### Claim 23 (depends on 22) The socket of claim 22 wherein said actuator comprises a cam rotationally coupled to said PCB and said support plate, said cam having an unlatched position and a latched position corresponding to said first and second positions, respectively. ### Claim 24 (depends on 23) The socket of claim 23 wherein said cam comprises a vertical eccentric cam having a slotted head. ### Claim 25 (depends on 24) The socket of claim 24 wherein said vertical eccentric cam further includes a detent formed to engage said support plate in said first and second positions. ### Claim 26 (depends on 23) The socket of claim 23 wherein said cam comprises a horizontal cam.