# US 5,706,578 A · Method for producing a three-dimensional circuit arrangement > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,706,578 A - Document ID: US5706578A - Status: Granted - Kind: A - Application number: 08/693,143 - Filed: 1996-08-13 - Granted: 1998-01-13 - Earliest claimed: 1994-02-16 - Assignees: Siemens Aktiengesellschaft - Inventors: Holger Hubner - Web page: https://patentgrep.com/patent/US5706578A ## CPC - H10W 90/00: Package configurations - H10W 72/07251: {characterised by changes in properties of the bump connectors during connecting} - H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps - H10W 90/297: {characterised by the through-semiconductor vias [TSVs] in the stacked chips} - H10W 90/722: {between stacked chips} - Y10T 29/49126: Assembling bases - Y10T 29/49155: Manufacturing circuit on or in base - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract Substrates (11, 12) each of which having components with contacts (13, 14) are arranged one above the other in a stack in order to produce a three-dimensional circuit arrangement. Metal surfaces (20) are applied onto that main surface (15) of at least one of the substrates (11) which is adjacent to the other substrate, which metal surfaces (20) are soldered to the adjacent main surface (17) of the other substrate (12) in order to produce the mechanical joint between the two substrates (11, 12). The components can be tested before the application of further substrates, and substrates having faulty components are removed by grinding away into the metal surfaces (20). ## Claims ### Claim 1 A method for producing a three-dimensional circuit arrangement, comprising the steps of: providing at least a first substrate and a second substrate, each of said first and second substrates having at least one component; arranging above one another in a stack the first substrate and the second substrate; applying main metal surfaces onto a main surface of at least one substrate of the first and second substrates which is adjacent to the other substrate of the first and second substrate; soldering the main metal surfaces to an adjacent main surface of the other substrate by application of solder metal and heating, the solder metal mixing completely with a material of the main metal surfaces so that an intermetallic phase is formed, and a firm joint is produced between the first substrate and the second substrate; matching the material of the main metal surfaces and the solder metal to one another such that a melting temperature of the intermetallic phase is higher than an operating temperature of the three-dimensional circuit arrangement and is higher than a melting temperature of the pure solder metal; forming insulating trenches between the main metal surfaces and adjacent contacts which are arranged on a common main surface. ### Claim 2 (depends on 1) The method as claimed in claim 1, wherein the metal surfaces include nickel and the solder metal includes gallium, wherein a quantity of solder metal is dimensioned such that an intermetallic phase having a gallium component of a maximum of 25 percent by weight forms after complete mixing with the material of the metal surfaces. ### Claim 3 (depends on 1) The method as claimed in claim 1, wherein additional metal surfaces, each of which are adjacent to one of the main metal surfaces, are applied on a main surface of the respective other substrate, wherein the main metal surfaces are soldered to the adjacent additional metal surfaces. ### Claim 4 (depends on 3) The method as claimed in claim 3, wherein the additional metal surfaces are formed from tungsten. ### Claim 5 (depends on 1) The method as claimed in claim 1, wherein contacts in both of the first and second substrates are adjacent to the main surface which is adjacent to the other substrate, wherein, during soldering, the solder metal forms an electrical connection between contacts, on the first substrate and on the second substrate. ### Claim 6 (depends on 1) The method as claimed in claim 1, wherein the insulating trenches are filled with material which is not wetted by the solder metal. ### Claim 7 (depends on 6) The method as claimed in claim 6, wherein the insulating trenches have a width of at least 1 .mu.m, wherein the solder metal is applied as a layer with a thickness of at most 1 .mu.m, wherein the insulating trenches are filled with polyimide or silicone. ### Claim 8 (depends on 1) The method as claimed in claim 1, wherein base of the insulating trench is at least partially covered by an auxiliary layer which is not wettable by the solder metal, wherein the auxiliary layer covers at least an edge of the base of the insulating trench. ### Claim 9 (depends on 8) The method as claimed in claim 8, wherein the auxiliary layer covers flanks of the metal surfaces which are adjacent to the insulating trenches. ### Claim 10 (depends on 8) The method as claimed in claim 8, wherein the auxiliary layer is arranged under the metal surface. ### Claim 11 (depends on 1) The method according to claim 1, wherein the auxiliary layer is formed from tungsten, tantalum, aluminum, titanium oxide, tantalum oxide, chromium oxide, a nitride or a polymer. ### Claim 12 (depends on 5) The method as claimed in claim 5, wherein at least one metal surface is formed for the electrical connection of a first contact in the first substrate and a second contact in the second substrate, which do not meet one another in a region of the mutually adjacent main surfaces, such that said metal surface forms an interconnect between the first contact and the second contact. ### Claim 13 (depends on 1) The method as claimed in claim 1, wherein a diffusion barrier layer is applied onto the main metal surfaces before the application of the solder metal, which diffusion barrier layer delays diffusion of the solder metal into the main metal surfaces. ### Claim 14 (depends on 1) The method as claimed in claim 1, wherein, after the first substrate and the second substrate have been joined by soldering, the components of the first and second substrates are tested, wherein, if faulty components occur, the substrate including is removed by grinding away, wherein the solder metal is removed during the grinding away and is ground as far as the metal surfaces which are arranged on the remaining substrate, such that a new substrate can be soldered via these metal surfaces to the remaining substrate.