# US 5,706,201 A · Software to determine the position of the center of a wafer

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- Number: US 5,706,201 A
- Document ID: US5706201A
- Status: Granted
- Kind: A
- Application number: 08/643,908
- Filed: 1996-05-07
- Granted: 1998-01-06
- Earliest claimed: 1996-05-07
- Assignees: Fortrend Engineering Corporation
- Inventors: J. Randolph Andrews
- Web page: https://patentgrep.com/patent/US5706201A

## CPC

- H10P 74/23: {characterised by multiple measurements, corrections, marking or sorting processes}
- H10W 46/501: {for use before dicing}
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A computer program that evaluates data to determine the position of the center of a wafer. The program processes data generated by gate sensors that detect points on the wafer's outer edge. The sensors provide information about a leading and a trailing edge of the wafer. The program then determines if the data points are those on the circular perimeter of the wafer so that points on the flat or notch may be eliminated from the calculation of the center point.

## Claims

### Claim 1

A computer program to determine the position of the center of a wafer comprising the following steps:
(a) collect data in the form of a plurality of data points generated by sensors that determine the location of a leading and a trailing edge of said wafer,
(b) place said collected data in circumferential order,
(c) create multiple non-adjacent point pairs, said non-adjacent point pairs are created such that an arc between individual points of said non-adjacent point pairs is approximately 90.degree.,
(d) calculate a center point based on each said non-adjacent point pair, eliminating one of two possible solutions as falling outside an area of possible actual center locations,
(e) score said calculated center point by iterating through said data points, calculating distances from said data points to said calculated center point, and rewarding said calculated center point when said calculated distances are equal to a known radius of said wafer,
(f) reject calculated center points that receive low scores, and
(g) average the remaining calculated center points to reduce any measurement noise impact of a given data point, thereby arriving at a final calculated center point.