# US 5,706,175 A · Resin-sealed semiconductor device

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- Number: US 5,706,175 A
- Document ID: US5706175A
- Status: Granted
- Kind: A
- Application number: 08/502,642
- Filed: 1995-07-14
- Granted: 1998-01-06
- Earliest claimed: 1994-10-06
- Assignees: Kabushiki Kaisha Toshiba
- Inventors: Shinji Takei
- Web page: https://patentgrep.com/patent/US5706175A

## CPC

- H05K 3/285: {Permanent coating compositions}
- H10W 74/114: {by a substrate and the encapsulations}
- H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)}
- H10W 72/07353: {changes in shapes}
- H10W 72/075: {of bond wires}
- H10W 72/334: {Cross-sectional shape, i.e. in side view}
- H10W 72/536: {the connected ends being ball-shaped}
- H10W 72/5363: {the connected ends being wedge-shaped}
- H10W 72/552: {comprising metals or metalloids, e.g. silver}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 72/931: {Shapes of bond pads}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- Y10T 428/239: Complete cover or casing
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A resin-sealed semiconductor device includes a plurality of electronic components mounted on a printed wiring board, a circuit mounting surface of the board being resin-sealed, with connection terminals of the electronic components electrically connected to a printed wiring on the board. A surface portion of the board is coated with insulator material which contains tiny hollow spheres and constitutes a thermal expansion resin.

## Claims

### Claim 1

A resin sealed semiconductor device comprising:
a printed wiring board having a plurality of wirings on an upper surface portion thereof;
an electronic component mounted on the board and connected to at least one of the plurality of wirings;
an insulator material covering the upper surface portion of the board and containing tiny hollow spheres, wherein the insulator material is a resist material formed mainly of an epoxy resin and the insulator coats a printed wire region of the upper surface portion of the board, and wherein the resist material is a thermal expansion resin formed of copolymer of vinylidene chloride or acrylonitrile used as a core and isobutane capsuled as the spheres in the copolymer and used as a foaming agent, the resist material expanding when heated at a temperature of 80 to 150.degree. C. to have a sphere diameter increased from 5 to 30 .mu.m to 10 to 100 .mu.m, and the tiny hollow spheres are mixed in the resist material in an amount of 3 to 10%; and
a resin sealing a part-mounting surface of the wiring board.

### Claim 2 (depends on 1)

A resin-sealed semiconductor device according to claim 1, wherein a plurality of electronic components are adhered onto the board in an exposed state, and the semiconductor device further includes resin-sealed LSI chips having terminals connected by metal wires to the plurality of wirings on the board.