# US 5,705,848 A · Power semiconductor module having a plurality of submodules > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,705,848 A - Document ID: US5705848A - Status: Granted - Kind: A - Application number: 08/562,454 - Filed: 1995-11-24 - Granted: 1998-01-06 - Earliest claimed: 1995-11-24 - Assignees: Asea Brown Boveri AG - Inventors: Reinhold Bayerer - Web page: https://patentgrep.com/patent/US5705848A ## CPC - H10W 90/00: Package configurations - H10W 44/501: {Inductive arrangements (H10W44/20 takes precedence)} - H05K 3/225: {Correcting or repairing of printed circuits (H05K1/0292, H05K3/222, H05K3/288, H05K3/4685 take precedence)} - H05K 3/341: Surface mounted components - H10W 72/07636: {Soldering or alloying} - H10W 72/07653: {changes in shapes} - H10W 72/534: {being rectangular} - H10W 72/5363: {the connected ends being wedge-shaped} - H10W 72/631: {Shapes of strap connectors} - H10W 72/951: {Materials of bond pads} - H10W 90/764: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract In the case of a power semiconductor module (34) having a plurality of submodules (37b), which are arranged next to one another on a common baseplate (35) and are electrically interconnected, and can be externally connected, on the power side in a low-inductance manner by means of conductors in the form of plates, a reduction in the space requirement is achieved by virtue of the fact that the conductors (40, 43) in the form of plates are each arranged in a self-supporting manner in planes above the submodules (37b), which planes have a vertical separation from one another and from the submodules (37b) which is sufficient for electrically insulation, and that the conductors (40, 43) in the form of plates are electrically connected to the individual submodules (37b) via additional, vertical conduction elements (38a,b ,42a-c). (FIGS. 4 and 7) ## Claims ### Claim 1 A power semiconductor module comprising: a plurality of electrically interconnected submodules accommodating power semiconductor chips; a common baseplate on which the submodules are arranged next to one another; conductors in the form of plates for externally connecting the submodules to power supply lines in a low-inductance manner; wherein the submodules are arranged in a close-packed manner on the common baseplate, in that the conductors in the form of plates are each arranged in a self-supporting manner in separate planes above the submodules, which planes have a vertical separation from one another and from the submodules which is sufficient for electrical insulation, and in that each conductor in the form of a plate is electrically connected to one type of semiconductor chip contact on a respective submodules via vertical conduction elements which include sheet-metal strips. ### Claim 2 (depends on 1) A power semiconductor module according to claim 1, wherein each sheet-metal strip comprises a main body which extends in a plane of one conductor in the form of a plate and has lateral portions for contacting several of the power semiconductor chips, which lateral portions are stretched out vertically. ### Claim 3 (depends on 2) A power semiconductor module according to claim 2, wherein the lateral portions of the sheet-metal strips have curves which permit them to compensate for a thermally induced expansion of at least one of the submodules and common baseplate in two independent directions. ### Claim 4 (depends on 3) A power semiconductor module according to claim 3, wherein at least one sheet-metal strip has a U-shaped main body with downwards oriented portions that each turn into horizontal first portions, which have second portions formed on their transverse sides. ### Claim 5 (depends on 3) A power semiconductor module according to claim 3, wherein at least one sheet-metal strip has an elongated main body, on long sides of which groups of portions extend downwards and turn into horizontal feet, which groups of portions are subdivided into narrow segments. ### Claim 6 (depends on 3) A power semiconductor module according to claim 3, wherein the sheet-metal strips are connected to the conductors in the form of plates and to the submodules by soldered joints. ### Claim 7 (depends on 3) A power semiconductor module according to claim 3, wherein conductors in the form of plates except an uppermost conductor are provided with perforations through which are routed vertical conduction elements for connection of the submodules to the conductors in the form of plates situated above the submodules. ### Claim 8 (depends on 3) A power semiconductor module according to claim 3, wherein the submodules together with associated conductors in the form of plates and the vertical conduction elements are arranged in a housing and are potted with an electrically insulating compound. ### Claim 9 (depends on 2) A power semiconductor module according to claim 2, wherein the sheet-metal strips are connected to the conductors in the form of plates and to the submodules by soldered joints. ### Claim 10 (depends on 9) A power semiconductor module according to claim 9, wherein conductors in the form of plates except an uppermost conductor are provided with perforations through which are routed vertical conduction elements for connection of the submodules to the conductors in the form of plates situated above the submodules. ### Claim 11 (depends on 9) A power semiconductor module according to claim 9, wherein the submodules together with associated conductors in the form of plates and the vertical conduction elements are arranged in a housing and are potted with an electrically insulating compound. ### Claim 12 (depends on 2) A power semiconductor module according to claim 2, wherein conductors in the form of plates except an uppermost conductor are provided with perforations through which are routed vertical conduction elements for connection of the submodules to the conductors in the form of plates situated above the submodules. ### Claim 13 (depends on 2) A power semiconductor module according to claim 2, wherein the submodules together with associated conductors in the form of plates and the vertical conduction elements are arranged in a housing and are potted with an electrically insulating compound. ### Claim 14 (depends on 1) A power semiconductor module according to claim 1, wherein the conductors in the form of plates except an uppermost conductor are provided with perforations through which are routed vertical conduction elements for connection of the submodules to the conductors in the form of plates situated above the submodules. ### Claim 15 (depends on 14) A power semiconductor module according to claim 14, wherein the submodules together with associated conductors in the form of plates and the vertical conduction elements are arranged in a housing and are potted with an electrically insulating compound. ### Claim 16 (depends on 1) A power semiconductor module according to claim 1, wherein the submodules together with associated conductors in the form of plates and the vertical conduction elements are arranged in a housing and are potted with an electrically insulating compound. ### Claim 17 (depends on 1) A power semiconductor module according to claim 1, wherein each submodule has an insulating substrate, which comprises a ceramic and is provided with a metallization layer on a top side, and in that a plurality of power semiconductors in chip form are arranged on the metallization layer and are electrically conductively connected to the metallization layer at an underside. ### Claim 18 (depends on 17) A power semiconductor module according to claim 17, wherein at least two of the power semiconductors of a submodule are controlled via two respective gates, and in that the gates are connected to a common gate element which is arranged between the power semiconductors on the substrate and can be externally connected. ### Claim 19 (depends on 18) A power semiconductor module according to claim 18, wherein the connection of the gates to the gate element takes place via individual gate resistors arranged on the gate element. ### Claim 20 (depends on 18) A power semiconductor module according to claim 18, wherein the power semiconductors which can be controlled via a gate are designed as insulated gate bipolar transistors and the remaining power semiconductors are designed as diodes.