# US 5,705,837 A · Solid-state image pick-up device of the charge-coupled device type synchronizing drive signals for a full-frame read-out

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- Number: US 5,705,837 A
- Document ID: US5705837A
- Status: Granted
- Kind: A
- Application number: 08/372,667
- Filed: 1995-01-13
- Granted: 1998-01-06
- Earliest claimed: 1990-07-06
- Assignees: Fuji Photo Film Co., Ltd.
- Inventors: Hiroshi Tanigawa; Hideki Mutoh; Tetsuo Toma; Kazuhiro Kawashiri
- Web page: https://patentgrep.com/patent/US5705837A

## CPC

- H04N 25/73: using interline transfer [IT]
- H04N 25/42: by switching between different modes of operation using different resolutions or aspect ratios, e.g. switching between interlaced and non-interlaced mode
- H04N 25/622: {by controlling anti-blooming drains}
- H10F 39/153: {Two-dimensional or three-dimensional array CCD image sensors}
- H10F 39/1536: {Frame transfer}
- H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION

## Abstract

A solid-state CCD image pick-up device includes optoelectric transducing elements corresponding to pixels vertically and horizontally arrayed in a matrix forming column linear arrays defining a column direction and at least one vertical charge transfer path associated with a corresponding adjacent column linear array. Pixel signals are vertically transferred from the column linear arrays to the vertical charge transfer paths such that gate signals occurring at predetermined times are applied to gate electrodes of the vertical charge transfer paths to permit the pixel signals to be scan read by a horizontal charge transfer path. Switching elements are provided for transfer gate electrodes and a drive circuit sequentially generates drive signals for groups of gate electrodes during periods in which the switching elements are rendered conductive to allow a full frame scan read to be performed by supplying a predetermined number of timing signals to the gate electrodes. The pick-up device can be fabricated with high density integration and high pixel density and can be provided with an improved vertical overflow drain structure. The image pick-up device also provides an electronic shutter function having improved vertical resolution. A shift register for producing improved vertical resolution is also disclosed.

## Claims

### Claim 1

A solid-state image pick-up device of the CCD type, said device comprising:
a n-type semiconductor substrate;
a vertical overflow drain structure for draining excessive charges in a photodetecting area into said semiconductor substrate;
a first p-type well layer buried in said semiconductor substrate;
said photodetecting region comprising a plurality of charge transfer paths formed in said first p-type well layer;
a second p-type well layer, formed separately from said first p-type well layer, and buried in said semiconductor substrate; and
a first drive circuit formed in said second p-type well layer, and a second drive circuit formed in said second p-type well layer, wherein each of said first and second drive circuits comprises a plurality of transistors, and wherein, within each of said drive circuits, said plurality of transistors have the same structure.

### Claim 2 (depends on 1)

A solid-state image pick-up device as claimed in claim 1, wherein said second p-type well layer comprises two p-type well regions, said first drive circuit being formed in one of said p-type well regions, and said second drive circuit being formed in the other of said p-type well regions .