# US 5,705,788 A · Process for treatment of materials with diode radiation > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,705,788 A - Document ID: US5705788A - Status: Granted - Kind: A - Application number: 08/557,070 - Filed: 1995-11-17 - Granted: 1998-01-06 - Earliest claimed: 1993-05-19 - Assignees: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. - Inventors: Eckhard Beyer; Konrad Wissenbach; Volker Krause - Web page: https://patentgrep.com/patent/US5705788A ## CPC - B23K 26/034: {Observing the temperature of the workpiece} - B23K 26/03: Observing, e.g. monitoring, the workpiece - B23K 26/06: Shaping the laser beam, e.g. by masks or multi-focusing - B23K 26/0604: {by a combination of beams} - B23K 26/0665: {by beam condensation on the workpiece, e.g. for focusing} - B23K 26/702: {Auxiliary equipment} - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM ## Abstract The invention relates to a process for material treatment with diode radiation, especially laser diode radiation. To match the radiation profile to the treatment process, the process is so carried out that radiation emitted from a multiplicity of diodes is directed with a predetermined radiation profile upon the treated region of the workpiece and that a change in the intensity distribution in the radiation profile is effected by controlling the diode output power. ## Claims ### Claim 1 A process for material treatment with diode radiation comprising the steps of: (a) emitting diode radiation from a plurality of diodes and directing the emitted radiation upon a treatment region of a workpiece; (b) varying an intensity distribution of a radiation profile of the radiation directed upon said region by controlling an output power of at least some of said diodes; (c) monitoring a temperature distribution of the treatment region produced by radiation from said diodes during irradiation thereof; and (d) controlling the variation of the intensity distribution in accordance with results of the monitoring. ### Claim 2 (depends on 1) The process defined in claim 1 wherein said plurality of diodes is assembled in a plurality of diode units and control of the output power is effected by controlling the power outputted from said units. ### Claim 3 (depends on 2) The process defined in claim 2 wherein said diode units are connected via optical coupling means to radiation guide means, the process further comprising focussing diode radiation from said guide means upon a working location of said region. ### Claim 4 (depends on 3) The process defined in claim 3 wherein light-conducting fibers are used as said radiation guide means, said process further comprising selectively juxtaposing said light-conducting fibers with said diodes individually and as grouped in said units. ### Claim 5 (depends on 1) The process defined in claim 1 wherein said radiation profile is detected with a detector, further comprising feeding measurement results from said detector to a central control unit for control of said output power. ### Claim 6 (depends on 5) The process defined in claim 5, further comprising arranging in a radiation path of radiation from said diodes a partially transparent mirror deflecting a fraction of radiation from diodes to said treatment region and a fraction of radiation from said diodes to said detector. ### Claim 7 (depends on 1) The process defined in claim 1, further comprising the steps of interposing a partially transparent mirror in a path of radiation from said diodes for deflecting heating radiation from said region, and feeding a detector unit for control of said output power through a filter impermeable to radiation from said diodes. ### Claim 8 (depends on 1) The process defined in claim 1 wherein temperature distribution is selectively detected over the entire region and over a predetermined location in said region irradiated by predetermined diode units containing groups of said diodes. ### Claim 9 (depends on 8) The process defined in claim 8 wherein detection of the temperature distribution of said region responds to overlapping radiation from a plurality of said diode units. ### Claim 10 (depends on 1) The process defined in claim 1 wherein radiation from said diodes is focussed on said region by a focussing unit, said radiation profile being detected by a detector unit positioned directly behind said focussing unit. ### Claim 11 (depends on 1) The process defined in claim 1, further comprising the step of guiding diode radiation to said region through a portion of a light fiber bundle and guiding emitted radiation from said region away therefrom through another portion of said light fiber bundle. ### Claim 12 (depends on 11) The process defined in claim 11, further comprising arranging one of said portions of the light fiber bundle outside of the other portion of said light fiber bundle. ### Claim 13 (depends on 1) The process defined in claim 1, further comprising the step of selectively effecting transformation hardening of said region and local melting of said region with said diode radiation. ### Claim 14 (depends on 1) The process defined in claim 1, further comprising the step of reforming and bending said workpiece in said region while controlling said output power at least in part in response to the geometry thereof. ### Claim 15 (depends on 1) The process defined in claim 1, further comprising the step of selectively effecting lattice structure alteration, reduction of intrinsic stress and laser cutting in said region with said diode radiation. ### Claim 16 (depends on 1) The process defined in claim 1, further comprising welding of said workpiece at said region. ### Claim 17 (depends on 1) The process defined in claim 1, further comprising selectively evaporating impurities and coating from said region. ### Claim 18 (depends on 1) The process defined in claim 1, further comprising effecting chip removal machining of said region. ### Claim 19 (depends on 1) The process defined in claim 1, further comprising melting solder in said region.