# US 5,705,429 A · Method of manufacturing aluminum wiring at a substrate temperature from 100 to 150 degrees celsius

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- Number: US 5,705,429 A
- Document ID: US5705429A
- Status: Granted
- Kind: A
- Application number: 08/467,846
- Filed: 1995-06-06
- Granted: 1998-01-06
- Earliest claimed: 1993-10-04
- Assignees: Yamaha Corporation
- Inventors: Takahisa Yamaha; Satoshi Hibino; Masaru Naito
- Web page: https://patentgrep.com/patent/US5705429A

## CPC

- H10W 20/056: {by filling conductive material into holes, grooves or trenches}
- H10P 14/44: Physical vapour deposition [PVD]
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

After forming a contact hole in an insulator layer, which is formed on a substrate covering an impurity doped region, a Ti film, a TiN film (or TiON film), and an Al alloy (for example, an alloy of Al--Si--Cu) layer are sputtered (consecutively from the bottom level) for forming a wiring material layer. A wiring layer is formed by patterning the wiring material layer in accordance with a wiring pattern. Portions with a 0% coverage of the Al alloy layer are eliminated by sputtering the Al alloy layer with a substrate temperature in a range between 100.degree.and 150.degree. C.

## Claims

### Claim 1

A method of manufacturing wiring, comprising the steps of:
forming on a substrate having a contact portion, an insulator layer, provided with a contact hole having a surface including a horizontal portion, a slope portion, and a vertical portion in alignment to said contact portion;
forming by sputtering a wiring material layer comprising a Ti film, a TiN, TiON or TiW film, and an Al alloy layer consecutively from a lower level, covering said contact hole and said insulator layer, wherein the entire thickness of said Al alloy layer is formed while said substrate is kept at a temperature in a range from 100.degree. to 150.degree. C.; and
patterning the wiring material layer to form a wiring layer according to a wiring pattern.

### Claim 2 (depends on 1)

A method of manufacturing wiring according to claim 1, wherein the sputtering of said Ti film and TiN, TiON or TiW film is performed in a same apparatus without breaking vacuum.

### Claim 3 (depends on 1)

A method of manufacturing wiring according to claim 1, wherein said TiN, TiON or TiW film is TiN film and the sputtering of said TiN film is achieved with a target of Ti in an atmosphere including N.sub.2.

### Claim 4 (depends on 1)

A method of manufacturing wiring according to claim 1, wherein the sputtering of said Al alloy layer is performed under such conditions that a distance between an Al alloy target and the substrate, an atmosphere, and an Al alloy pressure are selected to allow deposition of Al alloy on a side wall of said contact hole.

### Claim 5 (depends on 4)

A method of manufacturing wiring according to claim 4, wherein the sputtering of said Al alloy layer is achieved to such a thickness that said contact hole is not buried completely.

### Claim 6 (depends on 1)

A method of manufacturing wiring according to claim 1, wherein the height of said vertical portion is in a range of 0.1 to 0.7 .mu.m.

### Claim 7 (depends on 6)

A method of manufacturing wiring according to claim 6, wherein said height of the vertical portion is in a range of 0.3 to 0.6 .mu.m.

### Claim 8 (depends on 6)

A method of manufacturing wiring according to claim 6, wherein said contact hole comprises a diameter equal to or smaller than 1 .mu.m.

### Claim 9

A method of manufacturing a semiconductor device, comprising the steps of:
(a) providing a semiconductor substrate;
(b) forming an insulating layer over the substrate;
(c) forming a hole through the insulating layer, wherein the hole has a vertical wall and a sloped portion; and
(d) forming a lower conductive layer and an aluminum or aluminum alloy upper conductive layer on said insulating layer and said hole to collectively form a patterned conductive wiring, wherein the entire thickness of the upper conductive layer is formed at a substrate temperature in a range from 100.degree. C. to 150.degree. C.

### Claim 10 (depends on 9)

A method according to claim 9, wherein the insulating layer comprises a material selected from a group consisting of boron phosphosilicate glass (BPSG), phosphosilicate glass (PSG), spin-on-glass (SOG), and tetraethoxysilane (TEOS) oxide.

### Claim 11 (depends on 9)

A method according to claim 9, wherein the height of the vertical wall is in a range of 0.1 to 0.7 .mu.m.

### Claim 12 (depends on 11)

A method according to claim 11, wherein the height of the vertical wall is in a range of 0.3 to 0.6 .mu.m.

### Claim 13 (depends on 11)

A method according to claim 11, wherein the hole comprises a diameter equal to or smaller than 1 .mu.m.

### Claim 14 (depends on 9)

A method according to claim 9, wherein in the step (d), the lower conductive layer comprises a material selected from a group consisting of TiN, TiON, and TiW.

### Claim 15 (depends on 14)

A method according to claim 14, wherein the step (d) further comprising the step of:
(d-1) prior to forming the lower conductive layer, forming a Ti layer over the insulating layer.

### Claim 16 (depends on 9)

A method according to claim 9, wherein in the step (d), the upper conductive layer comprises a material selected from a group of Al--Cu and Al--Si--Cu alloys.

### Claim 17 (depends on 9)

A method according to claim 9, further comprising the step of:
(e) forming a third conductive layer over the upper conductive layer.

### Claim 18 (depends on 7)

A method according to claim 7, wherein the third conductive layer comprises TiN.

### Claim 19 (depends on 9)

A method according to claim 9, wherein the lower and upper conductive layers are formed through sputtering technique.

### Claim 20

A method of manufacturing a semiconductor device on a substrate having an insulating layer thereover, comprising the steps of:
(a) forming a contact hole having a wall being substantially vertical and a slope portion above the wall, wherein the wall and the slope portion collectively constitute the contact hole; and
(b) forming an aluminum or aluminum alloy conductive layer over the contact hole, wherein the entire thickness of said aluminum or aluminum alloy conductive layer is formed while said substrate is kept at a substrate temperature in a range from 100.degree. to 150.degree. C.

### Claim 21 (depends on 1)

A method according to claim 1, further comprising the step of:
forming an interlayer insulating layer over the wiring layer.

### Claim 22 (depends on 21)

A method according to claim 21, wherein the interlayer insulating layer comprises a material selected from a group consisting of BPSG, PSG and oxide formed from TEOS.

### Claim 23 (depends on 9)

A method according to claim 9, further comprising the step of:
forming an interlayer insulating layer over the patterned conductive wiring.

### Claim 24 (depends on 23)

A method according to claim 23, wherein the interlayer insulating layer comprises a material selected from a group consisting of BPSG, PSG and oxide formed from TEOS.

### Claim 25 (depends on 20)

A method according to claim 20, further comprising the step of:
forming an interlayer insulating layer over the conductive layer.

### Claim 26 (depends on 25)

A method according to claim 25, wherein the interlayer insulating layer comprises a material selected from a group consisting of BPSG, PSG and oxide formed from TEOS.