# US 5,705,299 A · Large die photolithography > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,705,299 A - Document ID: US5705299A - Status: Granted - Kind: A - Application number: 07/990,992 - Filed: 1992-12-16 - Granted: 1998-01-06 - Earliest claimed: 1992-12-16 - Assignees: Texas Instruments Incorporated - Inventors: Claude E. Tew; Frank J. Poradish - Web page: https://patentgrep.com/patent/US5705299A ## CPC - G03F 7/70433: {Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors} - G03F 7/70475: {Stitching, i.e. connecting image fields to produce a device field, the field occupied by a device such as a memory chip, processor chip, CCD, flat panel display} - G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G) ## Abstract An improved reticle (20) and method of using it to expose layers of wafers for large integrated circuits (10). The integrated circuit (10) is designed so that nonrepeating patterns are laid out in perimeter areas, distinct from the center area containing contiguous repeating patterns. The reticle (20) is patterned with multiple masks (21-23), with different masks representing the repeating and nonrepeating patterns. The mask (22) representing the repeating pattern may then be stepped and illuminated separately from any mask (21, 23) representing a nonrepeating pattern. ## Claims ### Claim 1 A reticle for exposing a layer of a device made by photolithographic techniques, comprising: a transparent substrate; a nonrepeating mask on said substrate, having a first pattern for exposing a nonrepeating set of components; and a repeating mask patterned on said substrate, having a second pattern for exposing a contiguously stepped set of repeating components, wherein said nonrepeating set of components is contiguous with and allows connection between itself and at least one of said set of repeating components on one chip. ### Claim 2 (depends on 1) The reticle of claim 1, wherein said nonrepeating mask represents a set of components in a perimeter of the device. ### Claim 3 (depends on 1) The reticle of claim 1, wherein said repeating mask represents a portion of an array of identical components in the center of the device. ### Claim 4 A reticle for exposing at least one layer of a semiconductor wafer, comprising: a transparent substrate; a nonrepeating mask patterned on said substrate, having a first pattern for exposing a nonrepeating subcircuit; and a repeating mask patterned on said substrate, having a second pattern for exposing a contiguously stepped set of repeating subcircuits on the center portion of said wafer, wherein said nonrepeating subcircuit is contiguous with and allows connection between itself and at least one of said set of repeating subcircuits on one chip. ### Claim 5 (depends on 4) The reticle of claim 4, wherein said nonrepeating mask has pattern that represents peripheral control subcircuitry at a perimeter of the integrated circuit. ### Claim 6 (depends on 4) The reticle of claim 4, and further comprising an another nonrepeating mask on said substrate, having a third pattern for exposing another subcircuit pattern at a perimeter of the integrated circuit. ### Claim 7 (depends on 6) The reticle of claim 6, wherein said nonrepeating masks are on opposing sides of the integrated circuit. ### Claim 8 (depends on 6) The reticle of claim 6, wherein said nonrepeating masks are on adjacent sides of the integrated circuit. ### Claim 9 (depends on 8) The method of claim 8, wherein said blocking step is performed with shuttering devices of photolithographic equipment. ### Claim 10 (depends on 4) The reticle of claim 4, wherein said repeating mask has a pattern that represents memory cells. ### Claim 11 (depends on 4) The reticle of claim 4, wherein said repeating mask has a pattern that represents deformable mirror pixel elements. ### Claim 12 A method of exposing wafers made with photolithographic stepper equipment, for devices having an array of repeating components whose repeatability exceeds the stepping increments of the photolithographic equipment, comprising the steps of: patterning the device into subareas, wherein a nonrepeating pattern is laid out in a perimeter area of the device and a repeating pattern is laid out in a center area of the device; fabricating a lithographic reticle for said nonrepeating and repeating patterns, such that a single reticle has a nonrepeating mask and a repeating mask; blocking said repeating mask area such that only said nonrepeating mask area transmits light to said perimeter area; illuminating said reticle to expose the surface of said device with the pattern of said nonrepeating mask; moving said reticle to expose a portion of said center area; blocking said nonrepeating mask such that only said repeating mask transmits radiation; and stepping said repeating mask a number of times, to expose a number of contiguous repeating patterns in said center area.