# US 5,704,820 A · Method for making improved pillar structure for field emission devices

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- Number: US 5,704,820 A
- Document ID: US5704820A
- Status: Granted
- Kind: A
- Application number: 08/381,377
- Filed: 1995-01-31
- Granted: 1998-01-06
- Earliest claimed: 1995-01-31
- Assignees: Lucent Technologies Inc.
- Inventors: Edwin Arthur Chandross; Sungho Jin; Gregory Peter Kochanski; John Thomson, Jr.; Wei Zhu
- Web page: https://patentgrep.com/patent/US5704820A

## CPC

- H01J 9/242: {Spacers between faceplate and backplate}
- H01J 31/123: {Flat display tubes}
- H01J 2329/863: characterised by the form or structure
- H01J 2329/8635: having a corrugated lateral surface
- H01J 2329/864: characterised by the material
- H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H)

## Abstract

The pillar structure according to the invention has a substantially longer surface path length from negative to positive electrodes resist breakdown in a high voltage environment. The processing and assembly methods in this invention permit low-cost manufacturing of high breakdown-voltage, dielectric pillars for the flat panel display.

## Claims

### Claim 1

A method for making an electron field emission device comprising an emitter cathode electrode, a anode electrode and a plurality of insulating pillars for separating said electrodes, comprising the steps of:
providing said electrodes;
forming a mold having grooved wall cavities;
molding dielectric pillars in said cavities, said pillars having grooved outer surfaces;
adhering said pillars to one of said electrodes; and
finishing said device.

### Claim 2 (depends on 1)

The method of claim 1 wherein said mold is formed by preparing a multilayer composite with layers having different dissolution rates, forming holes in said composite, and etching said composite.

### Claim 3 (depends on 1)

The method of claim 1 wherein said mold is formed by preparing a multilayer composite with layers having different solvent swelling rates, forming holes in said composite, and subjecting said composite to solvent.