# US 5,704,593 A · Film carrier tape for semiconductor package and semiconductor device employing the same

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- Number: US 5,704,593 A
- Document ID: US5704593A
- Status: Granted
- Kind: A
- Application number: 08/780,844
- Filed: 1997-01-09
- Granted: 1998-01-06
- Earliest claimed: 1993-09-20
- Assignees: NEC Corporation
- Inventors: Hirokazu Honda
- Web page: https://patentgrep.com/patent/US5704593A

## CPC

- H10W 72/701: {Tape-automated bond [TAB] connectors}
- H10W 70/442: {of multiple leadframes in a single chip}
- H10W 70/467: {Multilayered additional interconnections}
- H10W 72/07141: {Means for applying energy, e.g. ovens or lasers}
- H10W 72/077: {Connecting of TAB connectors}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A film carrier tape for a semiconductor package comprises a tape base film having a signal plane with leads disposed thereon and a ground plane on the surface opposite the signal plane. The ground plane has ground plane leads projecting into a device hole and OLB lead holes defined in the tape base film, the ground plane leads confronting the leads on the signal plane. The ground plane leads are electrically connected to selected leads on the signal plane.

## Claims

### Claim 1

A semiconductor device comprising a semiconductor chip having a plurality of electrodes and a film carrier tape provided for leading out each of said electrodes of said semiconductor chip, said film carrier tape including:
an insulating film having a first main surface and a second main surface opposing to said first main surface,
a plurality of first leads formed on said first main surface apart from one another and each having a first portion which projects from said insulating film and is bonded to an associated one of said electrodes of said semiconductor chip, and
at least one second lead formed on said second main surface of said insulating film and having a second portion which projects from said insulating film, said second portion of said at least one second lead being bent toward and bonded to said first portion of one of said first leads.

### Claim 2 (depends on 1)

The device as claimed in claim 1, wherein:
said one of said first leads further has a third portion projecting from said insulating film in a direction opposite to a projecting direction of said first portion thereof, and
said at least one second lead further has a fourth portion projecting from said insulating film in a direction opposite to a projecting direction of said second portion, said fourth portion being bent toward and connected to said third portion of said one of said first leads.

### Claim 3 (depends on 1)

The device as claimed in claim 1, wherein said at least one second lead is supplies with a ground voltage.

### Claim 4

A semiconductor device comprising a semiconductor chip having a plurality of electrodes and a film carrier tape provided for leading out each of said electrodes of said semiconductor chip, said film carrier tape including:
an insulating film having a first main surface and a second main surface opposing to said first main surface,
a plurality of first leads formed on said first main surface apart from one another, each having a first portion which projects from said insulating film and is bonded to an associated one of said electrodes of said semiconductor chip, and
a conductive film formed on said second main surface and having a plurality of second leads each projecting from said insulating film, said second leads spaced apart from one another and corresponding to an associated one of said first portions, at least one of said second leads of said conductive film being bent toward and bonded to an associated one of said first portions, said second leads that are not bent and bonded to an associated one of said first portions being parallel with an associated one of said first portions.

### Claim 5 (depends on 4)

The device as claimed in claim 4, wherein:
said one of said first leads further has a second portion projecting from said insulating film in a direction opposite to a projecting direction of said first portion thereof, and
said conductive film further has a plurality of third leads each projecting from said insulating film in a direction opposite to a projecting direction of said second leads, said third leads corresponding to an associated one of said second portions and with an associated one of said second leads,
at least one of said third leads being bent and connected to an associated one of said second portions of said first leads such that said at least one of said second leads and said at least one of said third leads are electrically connected to an associated one of said first leads, said third leads that are not bent and connected to an associated one of said second portions being parallel with the associated second portion of one of said first leads.

### Claim 6 (depends on 4)

The device as claimed in claim 4, wherein said conductive film is supplied with a ground voltage.