# US 5,704,287 A · Flip up side stencil to be used with single site stencil printer

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- Number: US 5,704,287 A
- Document ID: US5704287A
- Status: Granted
- Kind: A
- Application number: 08/773,436
- Filed: 1996-12-27
- Granted: 1998-01-06
- Earliest claimed: 1996-12-27
- Inventors: Michael K. Omori; Floyd Gary Miller
- Web page: https://patentgrep.com/patent/US5704287A

## CPC

- H05K 3/1225: {Screens or stencils; Holders therefor}
- B05C 17/06: Stencils (B05C17/04 takes precedence; stencils used in connection with printing plates or foils B41N1/24; drawing accessories B43L13/00)
- B41C 1/14: for stencil-printing or silk-screen printing
- B41F 15/36: flat
- B41P 2215/12: Screens
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- B05C: APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL (spraying apparatus, atomising apparatus, nozzles B05B; plant for applying liquids or other fluent materials to objects by electrostatic spraying B05B5/08)
- B41C: PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES (photomechanical processes for producing printing surfaces G03F; photoelectrical processes for producing printing surfaces G03G)
- B41F: PRINTING MACHINES OR PRESSES (manifolding devices or office printing machines B41L)
- B41P: INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS

## Abstract

Stencils to be used with a solder paste stencil printing process and apparatus in which the stencil plate having a porous figure printing area may be used for single component solder paste application. The printing operation is performed by alignment of the stencil pattern figure over the appropriate component and substrate pads. The stencil holder assembly is attached to the related solder paste stencil printer and held in place by downward force. Solder paste is dispensed over the stencil plate pattern allowing gravity flow of the paste material into the stencil pattern pores. Excess paste material is squeegeed level to the top surface of the stencil plate and the plate lifted from the substrate surface leaving solder paste in the configured pattern.

## Claims

### Claim 1

A solder paste stencil holder having a center portion, there being three sides extending from the center portion, with etches along the lines where said side join said center portion, a mounting block, and a shaft comprising:
said center portion comprises a stencil plate, said sides being folded up along the etches;
said mounting block being attached to the stencil plate via said folded-up sides; and
said shaft being affixed to the mounting block.

### Claim 2 (depends on 1)

A solder paste stencil holder according to claim 1, wherein said stencil holder further comprises:
said stencil plate having a plurality of apertures conforming to a footprint pattern; and
said sides being of varying height as to allow the mounting block to be placed in various positions.