# US 5,704,116 A · Method of holding a component using an anhydride fluxing agent > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,704,116 A - Document ID: US5704116A - Status: Granted - Kind: A - Application number: 08/642,708 - Filed: 1996-05-03 - Granted: 1998-01-06 - Earliest claimed: 1996-05-03 - Assignees: Motorola, Inc. - Inventors: Daniel Roman Gamota; Steven Lewis Wille; Steven Michael Scheifers; Michael Hertsberg - Web page: https://patentgrep.com/patent/US5704116A ## CPC - H05K 3/3489: Composition of fluxes; Application thereof; Other processes of activating the contact surfaces - B23K 35/3612: {with organic compounds as principal constituents} - H10W 72/30: Die-attach connectors - H10W 74/012: {of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills} - H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills - H05K 3/3431: {Leadless components} - H10W 72/073: {of die-attach connectors} - H10W 72/856: {Bump connectors and die-attach connectors (bumps embedded in underfills H10W74/15)} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - Y10T 29/49144: by metal fusion - Y10T 29/49146: with encapsulating, e.g., potting, etc. - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A solution (20) is dispensed onto bond pads (18) on a substrate (14). An integrated circuit component (12) that includes solder bumps (16) formed on component bond pads (30) is superposed onto the substrate (14) such that the solder bumps (16) rest against the bond pads (18). The solution (20) includes an anhydride compound that acts as a fluxing agent. The subassembly (11) is heated to a temperature sufficient to bond the solder bumps (16) to the bond pads (18) to form solder bump interconnections (26). During the bonding process, the fluxing agent substantially vaporizes and leaves virtually no residue on the substrate (14) to allow the component (12) to be effectively underfilled with a polymeric encapsulant (24). ## Claims ### Claim 1 A method for attaching an integrated circuit component comprising a plurality of solder bumps to a substrate comprising a plurality of bond pads, the method comprising: dispensing a solution onto the bond pads, said solution comprising a fluxing agent composed of an anhydride compound; superposing the integrated circuit component onto the substrate such that each of said solder bump rests against one of the bond pads and is held by the fluxing agent; and heating to bond the solder bumps to the bond pads and to vaporize the anhydride compound. ### Claim 2 (depends on 1) A method in accordance with claim 1, wherein the anhydride compound is methylhexahydrophthalic anhydride compound. ### Claim 3 (depends on 2) A method in accordance with claim 2, wherein the solution comprises methylhexahydrophthalic anhydride compound dissolved in a vaporizable vehicle. ### Claim 4 (depends on 1) A method in accordance with claim 1, wherein the anhydride compound is methyltetrahydrophthalic anhydride compound. ### Claim 5 (depends on 4) A method in accordance with claim 4, wherein the solution comprises methyltetrahydrophthalic anhydride compound dissolved in a vaporizable vehicle. ### Claim 6 (depends on 1) A method in accordance with claim 1, wherein the step of heating reflows a solder layer formed on the bond pads. ### Claim 7 A method for attaching an integrated circuit component comprising a plurality of solder bumps to a substrate comprising a plurality of bond pads, the method comprising: dispensing a solution comprising a fluxing agent composed of an anhydride compound and dissolved in a vaporizable vehicle onto the substrate including the bond pads; vaporizing the vehicle to form a tacky layer on the bond pads; superposing an integrated circuit component onto the substrate such that each of said solder bump rests against one of the bond pads and is held by the tacky layer, and such that a gap is formed between the integrated circuit component and the substrate; heating to bond the solder bumps to the bond pads and to vaporize the anhydride compound; and filling the gap with a polymeric encapsulant. ### Claim 8 (depends on 7) A method in accordance with claim 7, wherein the solution consists essentially of methylhexahydrophthalic anhydride in vaporizable alcohol. ### Claim 9 (depends on 7) A method in accordance with claim 7, further comprising the step of removing the anhydride compound vapors from the gap. ### Claim 10 (depends on 7) A method in accordance with claim 7, wherein the polymeric encapsulant is formed of a resinous composition that cures at a curing temperature, wherein the polymeric encapsulant reacts with residual anhydride at the curing temperature. ### Claim 11 (depends on 7) A method in accordance with claim 7, wherein the step of heating reflows a solder layer formed on the bond pads. ### Claim 12 A method for attaching an integrated circuit component comprising a plurality of solder bumps to a substrate comprising a plurality of bond pads, the method comprising: dispensing a solution composed of an anhydride compound dissolved in vaporizable alcohol onto the substrate such that the solution is applied to the bond pads; vaporizing the alcohol to form a tacky anhydride layer on the bond pads; superposing the integrated circuit component onto the substrate such that each of said solder bumps rests against one of the bond pads and is held by the tacky anhydride layer, and such that a gap is formed between the integrated circuit component and the substrate; heating to bond the solder bumps to the bond pads and to vaporize the tacky anhydride layer; and filling the gap with an epoxy-base resinous encapsulant that cures at a curing temperature and includes epoxy end groups and hydroxyl end groups that react with residual anhydride at the curing temperature.