# US 5,703,980 A · Method for low-loss insertion of an optical signal from an optical fibre to a waveguide integrated on to a semiconductor wafer > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,703,980 A - Document ID: US5703980A - Status: Granted - Kind: A - Application number: 08/710,775 - Filed: 1996-09-20 - Granted: 1997-12-30 - Earliest claimed: 1996-09-20 - Assignees: Northern Telecom Limited - Inventors: Thomas MacElwee; Stephen J. Kovacic; Jugnu J. Ojha - Web page: https://patentgrep.com/patent/US5703980A ## CPC - G02B 6/30: for use between fibre and thin-film device - G02B 6/2551: {using thermal methods, e.g. fusion welding by arc discharge, laser beam, plasma torch} - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS ## Abstract A method and apparatus are provided for coupling light from a fiber to a waveguide on an OEIC (optoelectronic integrated circuit). The region of the fiber to be connected is made into a D-fiber by removing a portion of its cladding. The flat surface is fused to a silicon dioxide coated portion of the waveguide. The light in the fiber is evanescently coupled into the waveguide on the OEIC which is typically a planar or channel waveguide. ## Claims ### Claim 1 An optically coupled arrangement comprising: an optical waveguide on an opto-electronic integrated circuit, the waveguide having a core, a first cladding underlying the core and a second cladding overlying the core, the second cladding having a first coupling surface; an optical fiber having a core and a cladding and having a portion of the cladding removed along the length of the fiber to form a second coupling surface, the second coupling surface being held in contact with the first coupling surface; whereby light propagating in either of the fiber or the waveguide is evanescently coupled between the fiber and the waveguide. ### Claim 2 (depends on 1) The optically coupled arrangement of claim 1 wherein a portion of the second cladding of the waveguide is thinner beneath the first coupling surface than elsewhere. ### Claim 3 (depends on 2) The optically coupled arrangement of claim 2 wherein the waveguide is a semiconductor waveguide. ### Claim 4 (depends on 3) The optically coupled arrangement of claim 3 wherein the second cladding comprises in sequence a semiconductor layer overlying the core of the waveguide and a silicon dioxide layer on which the first coupling surface is located. ### Claim 5 (depends on 4) The optically coupled arrangement of claim 4 wherein said optical fiber is a silica fiber. ### Claim 6 (depends on 5) The optically coupled arrangement of claim 5 wherein the first and second coupling surfaces are fused together. ### Claim 7 (depends on 4) The optically coupled arrangement of claim 4 wherein said portion of the second cladding which is made thinner is in said silicon dioxide layer. ### Claim 8 (depends on 4) The optically coupled arrangement of claim 4 wherein said portion of the second cladding which is made thinner is in said semiconductor layer. ### Claim 9 (depends on 4) The optically coupled arrangement of claim 4 wherein the first and second coupling surfaces are fused together. ### Claim 10 (depends on 3) The optically coupled arrangement of claim 3 wherein the first and second coupling surfaces are held together with adhesive. ### Claim 11 (depends on 2) The optically coupled arrangement of claim 2 wherein the first waveguide is a channel waveguide. ### Claim 12 (depends on 11) The optically coupled arrangement of claim 11 wherein the channel waveguide is tapered such that it is wider where the fiber is to be coupled, thereby reducing sensitivity to lateral placement of the fiber. ### Claim 13 (depends on 11) The optically coupled arrangement of claim 11 wherein the fiber is fused to the waveguide at an angle in the plane of the waveguide with respect to the core of the fiber, thereby reducing sensitivity to lateral placement of the fiber. ### Claim 14 (depends on 2) The optically coupled arrangement of claim 2 wherein said optical fiber is a silica fiber. ### Claim 15 (depends on 14) The optically coupled arrangement of claim 14 wherein the first and second coupling surfaces are fused together. ### Claim 16 (depends on 2) The optically coupled arrangement of claim 2 wherein the first and second coupling surfaces are held together with adhesive. ### Claim 17 (depends on 2) The optically coupled arrangement of claim 2 wherein the waveguide is a silicon dioxide waveguide. ### Claim 18 (depends on 2) The optically coupled arrangement of claim 2 wherein the cladding of the waveguide has an index of refraction which is less than that of the core of the fiber, and wherein the cladding of the fiber has an index of refraction which is less than that of the core of the waveguide. ### Claim 19 (depends on 1) The optically coupled arrangement of claim 1 wherein the waveguide is a semiconductor waveguide. ### Claim 20 (depends on 1) The optically coupled arrangement of claim 1 wherein the first and second coupling surfaces are held together with adhesive. ### Claim 21 (depends on 1) The optically coupled arrangement of claim 1 wherein the waveguide is a silicon dioxide waveguide. ### Claim 22 A method of making an optical coupling between a) an optical waveguide on an opto-electronic integrated circuit having a core, a first cladding underlying the core and a second cladding overlying the core, the second cladding having a first coupling surface; and b) an optical fiber having a core and a cladding; comprising the steps of: removing a portion of the cladding of the fiber along its length to form a second coupling surface; attaching the fiber to the waveguide such that the first coupling surface is held in contact with the second coupling surface. ### Claim 23 (depends on 22) The method according to claim 22 wherein the second cladding of the waveguide initially comprises a semiconductor layer, further comprising the step of: depositing or forming a silicon dioxide layer on the semiconductor layer, the silicon dioxide layer thereby becoming part of the second cladding. ### Claim 24 (depends on 23) The method according to claim 23 further comprising the step of removing a portion of the semiconductor layer of the second cladding of the waveguide beneath the first coupling surface before depositing or forming the silicon dioxide layer. ### Claim 25 (depends on 23) The method according to claim 23 further comprising the step of removing a portion of the silicon dioxide layer of the waveguide to create the first coupling surface. ### Claim 26 (depends on 22) The method according to claim 22 further comprising the step of: removing a portion of the second cladding of the waveguide to create the first coupling surface. ### Claim 27 (depends on 22) The method according to claim 22 wherein the step of attaching the fiber to the waveguide comprises the step of fusing the fiber to the waveguide. ### Claim 28 (depends on 22) The method according to claim 22 wherein the fiber is a silica fiber, and further comprising the step of fusing the fiber to the waveguide. ### Claim 29 (depends on 22) The method according to claim 22 wherein the waveguide is a channel waveguide and wherein the step of attaching the fiber to the waveguide comprises the step of fusing the fiber to the waveguide at an angle in the plane of the first waveguide with respect to the core of the fiber. ### Claim 30 (depends on 22) The method according to claim 22 wherein the waveguide is a channel waveguide, further comprising the step of defining the channel waveguide by etching a ridge in the second cladding layer. ### Claim 31 (depends on 22) The method according to claim 22 wherein the second cladding of the waveguide initially comprises a semiconductor layer, further comprising the step of: depositing or forming a silicon dioxide layer on the semiconductor layer; removing the entire silicon dioxide layer and a portion of the semiconductor layer to create the first coupling surface.