# US 5,703,893 A · Laser diode module

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- Number: US 5,703,893 A
- Document ID: US5703893A
- Status: Granted
- Kind: A
- Application number: 08/506,866
- Filed: 1995-07-25
- Granted: 1997-12-30
- Earliest claimed: 1995-01-13
- Assignees: Fujitsu Limited
- Inventors: Manabu Komiyama; Shunichi Sato; Noboru Sonetsuji; Tetsuo Ishizaka; Saeko Yokoi
- Web page: https://patentgrep.com/patent/US5703893A

## CPC

- H01S 5/02415: {by using a thermo-electric cooler [TEC], e.g. Peltier element}
- H01S 5/02216: Butterfly-type, i.e. with electrode pins extending horizontally from the housings
- H01S 5/0014: {Measuring characteristics or properties thereof (measuring techniques per se G01J, G01K, G01N, G01R)}
- H01S 5/005: {Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping (H01S5/026, H01S5/18388 take precedence)}
- H01S 5/02251: using optical fibres
- H01S 5/02438: {Characterized by cooling of elements other than the laser chip, e.g. an optical element being part of an external cavity or a collimating lens}
- H01S 5/042: Electrical excitation {; Circuits therefor (monolithically integrated laser drive components H01S5/0261)}
- H01S 5/06216: {Pulse modulation or generation}
- H01S 5/0683: by monitoring the optical output parameters
- H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL

## Abstract

Disclosed herein is a laser diode module having a thermoelectric cooling element, a laser diode, and a thermistor in a housing. The thermoelectric cooling element has a first surface and a second surface between which heat exchange is performed. The first surface is in close contact with an inner surface of the housing. A base is provided on the second surface in close contact therewith. A laser carrier and a thermistor carrier are provided on the base in close contact therewith. The laser diode and the thermistor are provided on the laser carrier and the thermistor carrier in close contact therewith, respectively. A portion of the base in the vicinity of the laser carrier is thermally connected to the housing by a metal plate, for example, thereby allowing high-precision temperature control of the laser diode.

## Claims

### Claim 1

A laser diode module comprising:
a housing;
a thermoelectric cooling element having a first surface and a second surface, said first surface being in close contact with an inner surface of said housing, for performing heat exchange between said first surface and said second surface according to a supplied control current;
a base having a third surface and a fourth surface, said third surface being in close thermal contact with said second surface of said cooling element;
a laser carrier and a thermistor carrier both provided on said base in close contact with said fourth surface;
a laser diode and a thermistor provided respectively on said laser carrier and said thermistor carrier in close thermal contact therewith; and
a metal plate directly connected between said fourth surface of said base and said housing for correcting a temperature balance between said laser diode and said thermistor by thermally connecting a portion of said fourth surface of said base directly to said housing.

### Claim 2 (depends on 1)

A laser diode module according to claim 1, wherein:
said housing and said base are formed of metal;
said housing is maintained at a ground potential; and
said metal plate electrically connects said laser carrier to said housing.

### Claim 3 (depends on 1)

A laser diode module according to claim 1, wherein a position on said base connected with said metal plate is opposite to said thermistor with respect to said laser carrier.

### Claim 4 (depends on 1)

A laser diode module according to claim 1, wherein a position on said housing connected with said metal plate is in the vicinity of said thermoelectric cooling element.

### Claim 5 (depends on 1)

A laser diode module according to claim 1, further comprising means for controlling said control current so that a temperature of said thermistor becomes constant, wherein a shape of said metal plate is set so that the temperature of said thermistor becomes substantially the same as a temperature of said laser diode while said control current is being controlled by said control means.

### Claim 6

A laser diode module comprising:
a laser diode;
means for supplying to said laser diode a drive current obtained by superimposing a modulation current on a bias current;
a thermoelectric cooling element for cooling said laser diode according to a control current supplied; and
means for extracting said bias current from said drive current and supplying said bias current extracted as said control current to said thermoelectric cooling element.

### Claim 7

A laser diode module comprising:
a housing;
a thermoelectric cooling element having a first surface and a second surface, said first surface being in close contact with an inner surface of said housing for performing heat exchange between said first surface and said second surface according to a supplied control current;
a base having a third surface and a fourth surface, said third surface being in close thermal contact with said second surface of said cooling element;
a laser carrier and a thermistor carrier both provided on said base in close thermal contact with said fourth surface;
a laser diode and a thermistor provided respectively on said laser carrier and said thermistor carrier in close thermal contact therewith, and;
a metal plate directly connected between said base and said housing, separate and distinct from said base, for correcting a temperature balance between said laser diode and said thermistor by thermally connecting a portion of said base to said housing.