# US 5,703,762 A · Arrangement for connecting wiring backplanes and module circuit boards

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 5,703,762 A
- Document ID: US5703762A
- Status: Granted
- Kind: A
- Application number: 08/492,791
- Filed: 1995-06-20
- Granted: 1997-12-30
- Earliest claimed: 1994-06-27
- Inventors: Karl Zell; Peter Seidel
- Web page: https://patentgrep.com/patent/US5703762A

## CPC

- H01R 12/00: Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures (printed connections to, or between, printed circuits H05K1/11)
- H01R 13/6585: Shielding material individually surrounding or interposed between mutually spaced contacts
- Y10S 174/34: PCB in box or housing
- Y10S 439/947: PCB mounted connector with ground terminal
- H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- Y10S: TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

## Abstract

An arrangement for connection of wiring backplanes and module circuit boards wherein individual contact passages arranged in a housing are surrounded by electrically conductive shielding plates that are connected to contactings that carry shield potential. They are attached in the intermediate grid both at the backplane side as well as at the assembly side, and are charged with a corresponding potential. In order to create a connector arrangement for extremely high transmission frequencies and good transmission properties, terminal ends of spring elements of the sheet metal shielding compartment and terminal ends of the spring elements of shielding plates of the contact passages abut with a contacting layer of precious metal at the backplane side. Both the spring elements of the shielding plates arranged perpendicular to the wiring backplane as well as the spring elements of the shielding compartment proceeding perpendicular to the wiring backplane are corrugated. Terminal lugs are provided on the precious metal layer on the wiring backplane in the cooperating region of the terminal ends. The housing is mechanically secured to the wiring backplane at a plurality of locations.

## Claims

### Claim 1

A system, comprising:
a module circuit board;
a wiring backplane;
a contact housing for connecting the module circuit board to the wiring backplane;
said contact housing being formed of a metal shielding compartment, portions of the metal shielding compartment facing toward the wiring backplane having a plurality of zig-zag shaped corrugated spring elements having terminal ends; and
the wiring backplane having a metal layer for contacting to and at the terminal ends of said zig-zag-shaped corrugated spring elements.

### Claim 2 (depends on 1)

The system according to claim 1 wherein the metal layer is a precious metal layer.

### Claim 3 (depends on 1)

The system according to claim 1 wherein the metal layer has terminal lugs projecting outwardly from the metal layer and shaped to provide a mating contact with said terminal ends of said zig-zag shaped corrugated spring elements.

### Claim 4 (depends on 3)

The system according to claim 3 wherein said terminal lugs comprise rounded projecting bumps.

### Claim 5 (depends on 4)

The system according to claim 4 wherein said terminal ends of the zig-zag shaped corrugated spring elements project beyond an end face of the housing so that when the housing is securely attached to the wiring backplane the corrugated spring elements are in a forced contact with the corresponding portions of the metal layer of the wiring backplane.