# US 5,703,744 A · Circuit substrate including anodization control means > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 5,703,744 A - Document ID: US5703744A - Status: Granted - Kind: A - Application number: 08/651,514 - Filed: 1996-05-22 - Granted: 1997-12-30 - Earliest claimed: 1995-05-25 - Assignees: Sharp Kabushiki Kaisha - Inventors: Akihito Jinda - Web page: https://patentgrep.com/patent/US5703744A ## CPC - H10D 30/0314: {of lateral top-gate TFTs comprising only a single gate} - B24B 37/013: Devices or means for detecting lapping completion - H10D 30/0321: {comprising silicon, e.g. amorphous silicon or polysilicon} - H10D 86/441: {Interconnections, e.g. scanning lines} - H10D 86/60: wherein the TFTs are in active matrices - H10P 74/238: {comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement} - H10P 74/277: {Circuits for electrically characterising or monitoring manufacturing processes, e.g. circuits in tested chips or circuits in testing wafers} - H10P 95/00: Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass - Y10S 257/90: MOSFET type gate sidewall insulating spacer - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES - B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - Y10S: TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS ## Abstract A circuit substrate includes a plurality of semiconductor devices including electrodes, a wiring having a plurality of branched portions and mainly formed of a metal material, a terminal for applying a voltage to the wiring to anodize the branched portions, and an anodization controller for controlling degrees of anodization of the branched portions. The branched portions serve as the electrodes of the semiconductor devices. The terminal is connected to the wiring. ## Claims ### Claim 1 A circuit substrate comprising: a wiring mainly formed of a metal material, the wiring having an end portion used as a electrode; a terminal for applying a voltage to the wiring to anodize the wiring, the terminal being connected to another end portion of the wiring; and an anodization control portion for controlling a degree of anodization of the wiring, the anodization control portion being a portion of the wiring which is closer to the another end portion connected to the terminal than to the end portion serving as the electrode, wherein the anodization control portion is anodized by the voltage applied by the terminal to form an insulator, and wherein at least one of either a width or a thickness of the anodization control portion is determined so that an anodization film having a predetermined thickness is formed on the surface of the end portion of the wiring when the anodization of the anodization control portion is completed. ### Claim 2 (depends on 1) A circuit substrate according to claim 1, wherein the circuit substrate has a substrate, and wherein the terminal, the wiring, and the anodization portion are all formed on the substrate of the circuit substrate. ### Claim 3 A circuit substrate comprising: a plurality of semiconductor devices including electrodes; a wiring having a plurality of branched portions and mainly formed of a metal material, the branched portions serving as the electrodes of the semiconductor devices; a terminal for applying a voltage to the wiring to anodize the branched portions, the terminal being connected to the wiring; and at least one anodization controlling portion for controlling degrees of anodization of the branched portions, wherein at least one of either a width or a thickness of the at least one anodization controlling portion is determined so that an anodization film having a predetermined thickness is formed on each of the branched portions. ### Claim 4 (depends on 3) A circuit substrate according to claim 3, wherein the anodization controlling portion is a portion of the wiring other than the branched portions. ### Claim 5 (depends on 4) A circuit substrate according to claim 4, wherein the portion has a narrower width than that of the branched portions. ### Claim 6 (depends on 4) A circuit substrate according to claim 4, wherein the portion is thinner than the branched portions. ### Claim 7 (depends on 3) A circuit substrate according to claim 3, wherein a plurality of anodization controlling portions are formed as portions of the branched portions and are connected in parallel with each other, each of the anodization controlling portions having a narrower width than that of a corresponding one of the branched portions. ### Claim 8 (depends on 7) A circuit substrate according to claim 7, wherein the anodization controlling portions have different widths. ### Claim 9 (depends on 3) A circuit substrate according to claim 3, wherein a plurality of anodization controlling portions are provided as portions of the branched portions and are connected in series, each of the anodization controlling portions having a narrower width than that of a corresponding one of the branched portions. ### Claim 10 (depends on 9) A circuit substrate according to claim 9, wherein the anodization controlling portions have different widths. ### Claim 11 (depends on 3) A circuit substrate according to claim 3, wherein a plurality of anodization controlling portions are provided as portions of the branched portions and are connected in parallel with each other, each of the anodization controlling portions having a thickness smaller than that of a corresponding one of the branched portions. ### Claim 12 (depends on 11) A circuit substrate according to claim 11, wherein the anodization controlling portions have different thicknesses. ### Claim 13 (depends on 3) A circuit substrate according to claim 3, wherein a plurality of anodization controlling portions are provided as portions of the branched portions and are connected in a series, each of the anodization controlling portions having a thickness smaller than that of a corresponding one of the branched portions. ### Claim 14 (depends on 13) A circuit substrate according to claim 13, wherein the anodization controlling portions have different thicknesses. ### Claim 15 (depends on 3) A circuit substrate according to claim 3, wherein a plurality of anodization controlling portions are provided, and at least one is a portion of the wiring other than the branched portions. ### Claim 16 (depends on 3) A circuit substrate according to claim 3, wherein the circuit substrate has a substrate, and wherein the terminal, the wiring, and the anodization portion are all formed on the substrate of the circuit substrate.